Earticle

본 논문에서는 openLCA와 Ecoinvent v3.10(Global)을 활용하여, 전자부품이 장착된 전자기판 제품을 기준으로 표면실장(SMT) 및 관통형(IMT) 방식과 유연납/무연납의 적용에 따른 환경영향을 정량적으로 평가하였다. 표면실장 (SMT) 방식은 리플로우 솔더링의 고온·장시간 가열 공정으로 인해, 모든 환경영향 범주에서 관통형(IMT)보다 높은 환경영향 부담을 유발하였으며, 특히 Climate Change(GWP) 항목에서는 약 4배 높은 온실가스 배출이 확인되었다. 표면실장(SMT)에서 무연납 사용 시 313.81 kgCO2eq, 유연납은 311.42 kgCO2eq로, 무연납이 더 큰 환경영향을 보였고, 관통형(IMT)에서는 무연납이 74.25 kgCO2eq, 유연납은 75.70 kgCO2eq로 무연납이 환경적 으로 더 우수했다. 이는 리플로우 대비 웨이브 솔더링의 에너지 소비가 낮기 때문으로 분석된다. 본 연구는 2000년대 초반 활발히 진행됬던 전자기판에 관한 환경영향을 최신 전자기판 공정 및 에너지 사용량에 따른 데이터베이스로 최신화하여 전과정평가를 진행하여 전자기판 생산에서 발생하는 환경영향 값에 대한 기초자료를 제공하고자 한다.

This study quantitatively evaluates the environmental impacts of surface mount technology (SMT) and insert mount technology (IMT), using openLCA and the Ecoinvent v3.10 (Global) database, based on electronic circuit boards with mounted components. SMT exhibited higher environmental burdens than IMT across all impact categories due to its high-temperature, long-duration reflow soldering process. In particular, the Climate Change (GWP) indicator showed approximately four times higher emissions in SMT. When using lead-free solder in SMT, the GWP was 313.81 kg CO -eq, compared to 311.42 kg CO -eq for leaded solder. Conversely, in IMT, lead-free solder resulted in lower emissions (74.25 kg CO -eq) than leaded solder (75.70 kg CO -eq), attributed to the lower energy demand of wave soldering. This study updates the early 2000s environmental assessments of electronic circuit boards by incorporating recent manufacturing processes and energy data, providing a foundational dataset for evaluating environmental impacts in modern PCB production.

Recently, Soldering of attaching electronic components(IC chip, Memory Board, etc.) on printed circuit board(PCB) is performed for reflow soldering process, which saves the process time and cost. On the other hand, the reflow soldering process has a bad effect on the thermal response of PCB. It may cause serious damages to the PCB, for example warpage of PCB and disconnection of copper patterns in PCB. It is important to predict the thermal response of PCB during the reflow soldering process in order to avoid serious damages of PCB. As the result, this study is performed to understand the mechanism of a reflow equipment and to analyze factors of thermal imbalance of PCB which is affected by the air flow, the interaction between inner temperature of a reflow equipment and the coefficient of thermal conduction of FR-4&BT, the copper patterns of PCB, and so on. This study is performed to predict the thermal response of PCB by the factors of thermal imbalance which was simulated using the CFD tool ICEPAK. The results of this study can be used in minimizing the thermal imbalance of PCB by an optimally designing the PCB and reflow equipment conditions.

In this study, the laser soldering process of probe-multilayer ceramic (MLC) substrates was optimized using Type 4 (T4) and Type 7 (T7) Sn-3.0Ag-0.5Cu (SAC305), T7 Sn-0.7Cu solders to improve the high-temperature durability of probe solder joints and satisfy the fine pitch requirements of the soldering process. Thermal cycle tests (TCTs) were performed to compare the heat resistance characteristics of the probe solder joint. The results showed that the bonding strength degradation rates of the SAC305 and Sn-0.7Cu solders after the TCT were within 40% compared to that of the as-soldered state. Because the probe surface and MLC were plated with Ni/Au, various intermetallic compounds (IMCs) were observed at the solder joint. The total IMC thickness of the T7 solder joint was thinner than that of the T4 solder because of the difference in redox reactions according to the particle size of the solder paste. The fracture surface of the probe-MLC solder joint after the shear strength test exhibited a mixed ductile and brittle fracture, and that of the Sn-0.7Cu solder joint exhibited a ductile fracture with numerous dimples.

This paper introduces the partial melting process for solder application and characterization of its feasibility using Sn-Ag, and Sn-Cu solder alloys. ill order to show that the liquid phase in the semi-liquid state maintains the similar wettability as single-phase liquid, the wetting balance tests are conducted with varying temperatures and compositions. Also, as a new soldering technology, the microstructural and mechanical test were investigated. The results from this research indicate that the partial melting can yield satisfactory sider joints as long as the liquid phase acquires sufficient chemical activity. At a condition where the partial melting is effective, a direct correlation between the wettability and the surface tension is found to exist.

The trend of the microjoining technology by the laser-soldering process has been reviewed. Among the production technologies, joining technology plays an important role in the fabrication of electronic components. This has led to an increasing attention towards the use of modern microjoining technology such as micro-resistance spot joining, micro-soldering, micro-friction stir joining and laser-soldering, etc. This review covers the recent technical trends of laser-soldering collected from the COMPENDEX DB analysis of published papers, research subject and research institutes.

To confirm the possibility of simultaneous bonding between Si chip and multilayer ceramic capacitors (MLCCs), vacuum reflow soldering is performed between a Si chip and each of 2012, 1608, 1005, 0603, and 0402 MLCCs us- ing Type-7 Sn-3.0Ag-0.5Cu (SAC305) and Sn-0.7Cu solder pastes. To enable an unbiased comparison with the vac- uum reflow process, the Si chip and MLCCs are bonded via thermo-compression (TC) bonding and hot air reflow soldering, respectively. The maximum void content of Si chip solder joints bonded via vacuum reflow is 8%. At the MLCC solder joints, the void content yielded by vacuum reflow is lower than that yielded by hot air reflow. The bonding strength of the MLCC solder joint afforded by vacuum reflow is higher than that afforded by hot air reflow. Vacuum reflow is superior to hot air reflow in terms of the void content and bonding strength of the MLCC solder joint. After performing a thermal cycle test (TCT), a crack appeared at the Si chip solder joint bonded by TC bonding. The Cu pillar/Sn-2.5Ag bump is susceptible to cracks after the TCT owing to the insufficient bonding layer thickness yielded; however, the SAC305 sample from vacuum reflow is stable. Meanwhile, (Cu,Ni)6Sn5, Ni3P, and Ag3Sn intermetallic compounds are formed at the MLCC solder joints and then further developed after the TCT. The results of this study indicate the possibility of co-bonding Si chip with MLCCs for semiconductor packaging.

The purposes of the paper are to analyze the fracture phenomenon by delamination and cracking when the encapsulant of plastic IC package with polyimide coating shows viscoelastic behavior under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by the approaches of stress analysis and fracture mechanics. The model is the plastic SOJ package with the polyimide coating surrounding chip and dimpled diepad. On the package without cracks, the optimum position and thickness of polyimide coating to decrease the maximum differences of strains at the bonding surfaces of parts of the package are studied. For the model delaminated fully between the chip and the dimpled diepad, C(t)-integral values are calculated for the various design variables. Finally, the optimal values of design variables to depress the delamination and crack growth in the plastic IC package are obtained.

Although PV module manufacturing and its structure are simple, the semi-permanent products can be used out doors for more than twenty years. Therefore it is need to choose proper materials and optimize manufacturing process. This paper suggest that factors of degradation need to be studied to achieve a more understanding of PV module Degradation rates and material failure. Nowadays durability of the PV Module is very important to sustain output safety for obtaining reliability. This paper is about the experiment that soldering uniformity of soldering process and to make least void from soldering process. From This study soldering flux residue and soldering method is main factor to form void blocked soldering uniformity and by using this.

A soldering process with longitudinal ultrasonic is conducted in this work using the Au bump and substrate. Localized heating of the solder is achieved and the stirring action due to the ultrasonic is found to influence the bond strength and microstructure of the eutectic solder. The acceptable bonding condition is determined from the tensile strength. Since the multiple bonds can be formed simultaneously with localized heating, the proposed ultrasonic soldering method appears to be applicable to the high-density electronic package.

최근 전자기기의 소형화, 다기능화 등으로 인한 전자부품 실장 영역의 한계치를 극복하고 플라스틱 사출물에 직접 회로를 인쇄하고 소자 및 부품을 실장하는 molded interconnect device (MID) 형태의 패키징 기법이 도입되고 있다. 다만 열 안정성이 낮은 플라스틱 사출물을 사용하는 경우, 종래의 리플로우 공정을 통한 부품 실장에 어려움이 있다. 본 연구에서는 특정 부위 혹은 소재만을 가열할 수 있는 유도가열 현상을 이용하여 플라스틱에 어떠한 열 데미지 없이 솔더를 용융시켜 실장하는 공정을 개발하였다. 가열하고자 하는 부위에 자속을 집중시킬 수 있는 유도가열용 Cu 코일 형상을 설계하고, 유한요소해석을 통해 패드부 자속 집중 및 가열 정도를 검증하였다. Polycarbonate 기판 위에 실장공정 검증을 위한 LED, capacitor, resistor, connector를 각각 유도가열을 통해 실장하고 작동여부를 확인하였다. 본 연구를 통해 리플로우 공법의 한계를 극복가능한 자기유도를 통한 선택적 가열 공정의 적용 가능성을 제시하였다.

Due to the miniaturization and multifunctionality of electronic devices, a surface mount technology in the form of molded interconnect devices (MID), which directly forms electrodes and circuits on the plastic injection parts and mounts components and parts on them, is being introduced to overcome the limitations in the mounting area of electronic components. However, when using plastic injection parts with low thermal stability, there are difficulties in mounting components through the conventional reflow process. In this study, we developed a process that utilizes induction heating, which can selectively heat specific areas or materials, to melt solder and mount components without causing any thermal damage to the plastic. We designed the shape of an induction heating Cu coil that can concentrate the magnetic flux on the area to be heated, and verified the concentration of the magnetic flux and the degree of heating on the pad part through finite element method (FEM). LEDs, capacitors, resistors, and connectors were mounted on a polycarbonate substrate using induction heating to verify the mounting process, and their functionality was confirmed. We presented the applicability of a selective heating process through magnetic induction that can overcome the limitations of the reflow method.

본 연구에서는 태양광 접속함 모듈 적용을 위한 유연 솔더(Sn-Pb) 및 무연 솔더(Sn-3.0Ag-0.5Cu 및 Sn-1.0Ag-0.7Cu-1.6Bi-0.2In)의 특성을 비교 평가하였다. 접속함 내에는 전압 및 전류 검출용 모듈, 고내압용 다이오드가 실장된 정류모듈 등 다양한 모듈이 내장되어있다. 본 연구에서는 솔더링특성, 인쇄성, 솔더형상 검사, X-ray를 이용한 솔더 내 void 검사 및 접합강도를 측정하였고, 무연 솔더 합금의 공정최적화는 step 1과 step 2로 구분하여 검토를 실시하였다. Step 1은 유연 솔더와 무연 솔더 페이스트 인쇄 검사 시험을 1차와 2차로 나누어 실험을 진행하였고 printability는 void 함량 및 접합강도의 상관관계로 검토하였다. 전체적으로 유연 솔더의 특성은 무연 솔더에 비하여 상대적으로 우수하였다. Step 2는 리플로우 공정의 최고점 온도 변화에 따른 접합부 특성 변화를 관찰하였다. 리플로우 최고 온도가 증가할수록 접합부 내의 void 함량이 2~4% 정도 감소하였고, 접합강도는 약 0.5 kgf 범위내에서 큰 차이 없이 나타났다. 기판 표면처리종류에 있어서는 ENIG 표면처리가 OSP 및 Pb-free 솔더 표면처리보다 우수한 접합강도를 나타내었다. 1종류의 무연솔더와 OSP 표면처리로 접합된 태양광 접속함 모듈의 500 싸이클 열충격 신뢰성시험 전후에 전기적 특성변화는 0.3% 내의 범위에서 안정적으로 작동함을 확인하였다.

The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.

Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shock teal. $(Cu,Ni)_6Sn_5$-type intermetallic compound of which thickness is about 5 micron was found at solder joint between Sn-Cu-Ni solder and copper land. After applying the thermal shock test of as-soldered product up to 750 cycles, no crack was found at the solder joint and the newly developed product was superior to conventions; one in terms of productivity and reliability.

The purpose of this study is to confirm the effect of staking and underfilling for mounting PBGA(Plastic Ball Grid Array) packaged components on satellites. With the goal of developing a process that complies with ECSS (European Cooperation for Space Standardization) standards, the effect of staking and underfilling was analyzed in terms of vibration and thermal properties, and actual test specimens were fabricated and verified. After the environmental test, microsections were performed to confirm whether cracks had actually occurred, and the rate of change in resistance value was confirmed and compared with the analysis results.

인쇄회로기판(PCB)은 전자 제품 생산에 널리 적용되는 요소부품으로 지속적으로 양적인 성장은 물론 집적도와 같은 질적인 발전도 묵과할 수 없다. 제조현장에서 보편적으로 웨이브 솔더링 장비가 사용되고 있으나 선행 연구 및 시제품 개발 단계에서는 각 PCB 제원에 맞는 전용 장비 환경을 구성할 수 없고, 범용의 고정 장비 환경에서 정해진 시간 내에 장비의 설정 조건만 변경하여 다양한 제품 군을 생산할 수밖에 없는 것이 일반적이다. 본 연구에서는 위와 같이 제한된 환경 내에서 최적의 공정 조건을 선택할 수 있도록 PCB 팔레트 도입 사례를 소개한다. 또한 현재 범용 장비에서 생산 가능 여부를 미리 판단할 수 있는 판별식을 제시하여 범용 웨이브 솔더링 장비 환경의 한계로 인해 발생할 수 있는 문제점을 사전에 파악하고 대응하도록 하고 궁극적으로 개발기간 단축 및 생산성 향상을 기대할 수 있도록 한다.

Printed circuit boards (PCBs) are a key component widely used in the production of electronic products, and not only quantitative growth but also qualitative developments such as integration cannot be ignored. Wave soldering equipment is commonly used equipment at manufacturing sites, but it is impossible to configure a dedicated equipment environment suitable for each PCB specification during the preliminary research and prototype development stage. It is neither suitable for development within limited time line nor manufacturing various product groups because only equipment setting conditions can be changed within a given time. In this study, we introduce a case of introducing a PCB pallet to enable selection of optimal process conditions within the limited environment described above. In addition, by presenting a discriminant that can determine in advance whether production is possible with current general-purpose equipment, it is expected that problems that may arise due to limitations in the general-purpose wave soldering equipment environment can be identified and resolved in advance. Ultimately, this palette makes it possible to shorten the development period and improve productivity.

PV셀과 리본의 솔더링 공정에서 열풍온도에 따른 $200{\mu}m$ 두께의 PV셀의 온도분포와 변형량의 해석 결과는 실험 측정치와 거의 일치함을 알 수 있었다. 또한 전기효율은 설정온도 $390^{\circ}C$로 PV셀을 솔더링한 모듈에서 가장 좋은 결과가 나타났다. 열풍온도를 $350^{\circ}C$로 설정하고 $150{\mu}m$ 두께의 PV셀을 솔더링 해석한 결과, 최대 변형량이 약 5.9mm로서 상당히 큰 값임을 확인할 수 있었으며, 열풍온도를 보다 낮은 온도로 설정해야 변형량이 감소하고 전기효율이 향상될 것을 예측하였다.

The analysis results of the temperature distribution and deformation at the PV cell with a thickness of $200{\mu}m$ according to hot-air temperature at the soldering process of a PV cell and ribbon tend to agree somewhat with the experimental measured values. The best result of the electrical efficiency appears in the module soldered at a hot-air temperature of $390^{\circ}C$. An analysis of the soldering PV cell with a thickness of $150{\mu}m$ at a hot-air temperature of $350^{\circ}C$ confirmed that the maximum deformation was approximately 5.9mm. As the temperature of hot air is set to decrease, the deformation is reduced and it is predicted that the electrical efficiency can be improved.