Earticle

The purpose of this study was to established the manufacturing process technology of an ultra-thin, multi-functional micro-implant(MFMI) that was optimized in fractured small animals, not mainly large animals. The test results showed a reckon type plate was more suitable than a straight plate because of excellent deformation energy. It was found that the structure of the hole and the screw could be fastened in all directions with the limited contact design of the threaded part cut off in 4 directions. It was possible to manufacture a reckon type plate reflecting the neck part of 2.0 mm width. It was confirmed that the plate hole could be stably and easily deformed and fastened without damaging the hole through the round type bending device.

Ultra-thin liquid films on solid substrates in contact with the saturated vapor are studied by using molecular dynamics simulation. The properties of evaporation and condensation of the films of various adsorptive strengths and thicknesses are obtained during the quasi-steady film evolution. Net condensations occur when the ultra-thin films on the high energy surface come into contact with the saturated vapor phase because the normal film pressure stays lower than the saturated vapor pressure. The net condensation rate is higher for the material combination of higher adsorptive strength. It becomes more so when the film thickness is of a lesser size. On the other hand, that of lower adsorptive strength has lower net condensation rate and depends less on the film thickness. Therefore, the size effect of the condensation phenomenon is more significant for the system of a higher adsorptive strength. This properties come from the state of ultra- thin film, which can be quantified by using disjoining pressure in the quasi-steady processes. These results have implications in practical problems concerning the moving contact line when the precursor film formation is critical.

Ultra thin sheet for electromagnetic interference(EMI) shielding purpose has been designed using base metal, PET & DST sheet stacking technology. Also, an automatic manufacturing system is developed. This ultra thin EMI shielding sheet is an effective shield against low frequency(~300kHz) EMI that can not shield completely by the existing EMI shielding sheet. And the developed automatic manufacturing system can stack ultra thin shielding sheet without any wrinkles.

In this study, 3D design, vibration analysis and experiment, and feed rate performance test were performed to develop a vibratory bowl feeder for supplying ultra-thin plate parts of less than 50 microns. The natural frequency and resonant frequency of the vibratory bowl feeder were obtained through the vibration analysis and experiment, and it was confirmed that the results of the analysis and experiment agree well. Through the feed rate experiment, it was confirmed that up to 610 ultra-thin parts per minute were fed at 250Hz and a supply voltage of 220V, where the excitation frequency and the resonant frequency match. And through analysis and experimental research, it was confirmed that the development of a vibratory bowl feeder for supplying ultra-thin parts was successful.

최근 다양한 전자카드가 보급되고 있으며 신용 카드, 교통 카드, 여권, 운전면허증, 공중전화 카드 등에서 다양하게 사용되고 있다. 이처럼 다양한 전자카드의 보급량과 사용량이 증가함에 응용 기술에 대한 필요성이 제기되고 있다. 본 논문에서 제안하고자 하는 LED 스마트카드는 사용 시 카드 내부에 포함되어 있는 압전 방식의 플렉시블 초박형 스피커에서 카드별 멜로디를 통해 사용자에게 LED 스마트카드 사용에 대한 알림을 전달하는 구성이다. 이와 같이 LED 스마트카드에 압전 방식의 초박형 플렉시블 스피커를 추가 하는 시스템에 대한 설계와 회로구현을 통해 LED 스마트카드를 개발하고 유용성을 검증하였다.

Recently, the spread of a variety of electronic card is using as credit cards, transportation cards, passports, driver's licenses, public phone card, and etc. LED smart cards need to raise application technique because variety of LED smart cards increasing supply and usage. in this paper, we propose a LED smart card contained inside the card that piezoelectric method flexible Ultra-thin speaker. and a melody flows when User using the LED smart card.. Therefore we are verified to useful through develop to electronic card that was designed system circuit and implemented circuit add in ultra-thin flexible Speaker based on piezoelectric.

The purpose of flow analysis is to develop a simple CFD analysis model to develop a heat transfer analysis model including transient heat transfer characteristics, especially phase change, of thin film evaporators. The simple analytical model focuses on the evaporation phase change. To reduce the computational cost, the shape was simplified to two dimensions, and the simulation time was set short with a focus on simulating the phase change phenomenon. In the future, based on this analysis model, we will develop an analysis model for simulating not only vaporization but also liquefaction, that is, transient distillation phenomenon, according to the shape of the thin film distillation device.

This study investigates the dynamic characteristics of telescopic booms for special-purpose vehicles fabricated with giga-grade ultra-high strength steel (UHSS) plates that have been increasingly adopted in industrial applications. In thin-walled structures such as telescopic booms, dynamic properties – particularly natural frequencies – are critical factors directly related to structural safety. Accordingly, the dynamic characteristics were experimentally measured and analyzed for identically designed booms fabricated using either imported giga-grade steel (Strenx 960) or domestic giga-grade steel (ATOS 980), both of which are widely available in the domestic market. The natural frequencies were identified based on frequency response functions (FRFs), and the corresponding mode shapes were obtained through experimental modal analysis. The results show that the nominal yield and tensile strengths provided by the manufacturers and the measured natural frequencies and mode shapes exhibit highly similar characteristics. These experimental findings confirm that the domestic UHSS exhibits a level of dynamic performance comparable to that of the imported steel of the same grade. Consequently, the results support the feasibility of applying domestic giga-grade UHSS to telescopic boom structures and highlight its potential contribution to material localization and enhanced design competitiveness in the domestic special-purpose vehicle industry.

대기 중에 존재하는 화합물의 반응을 연구하는 것은 대기 오염 화합물의 이동이나 소멸, 환경에의 영향을 파악하기 위하여 긴요하다. 특히 입자상 물질과 기체상 화합물과의 반응을 명확히 이해하는 것은 대기 오염물질의 거동을 파악하는데 매우 중요하다. 입자상 물질을 분석하는 방법 중에 EPMA(Electron Probe X-ray Microanalysis)를 이용한 단일 입자 분석법(Single Particle Analysis)은 개개 입자의 형상과 크기 그리고 화학 조성에 대한 정보를 동시에 제공하기 때문에 개개 입자의 생성, 이동, 반응성, 소멸 그리고 환경에의 영향에 대한 자세한 정보를 얻을 수 있다. (중략)

For the first time, high quality ultra-thin strained Si/SiGe on Insulator (SGOI) substrate with total SGOI thickness( $T_{Si}$ + $T_{SiGe}$) of 13 nm is developed to combine the device benefits of strained silicon and SOI. In the case of 6- 10 nm-thick top silicon, 100-110 % $I_{d,sat}$ and electron mobility increase are shown in long channel nFET devices. However, 20-30% reduction of $I_{d,sat}$ and electron mobility are observed with 3 nm top silicon for the same long channel device. These results clearly show that the FETs operates with higher performance due to the strain enhancement from the insertion of SiGe layer between the top silicon layer and the buried oxide(BOX) layer. The performance degradation of the extremely thin( 3 nm ) top Si device can be attributed to the scattering of the majority carriers at the interfaces.

Scaling rules for TFT application devices have led to the necessity of ultra thin dielectric films and high-k dielectric layers. In this paper, The advantages of high concentration of nitrogen in silicon oxide layer deposited by using $N_2O$ in Inductively Coupled Plasma Chemical Vapor Deposition (ICP-CVD) is investigated using X-ray energy dispersive spectroscopy (EDS). We have reported about Ellipsometric measurement, Capacitance - Voltage characterization and processing conditions.

$Ni(OH)_2/Ni$ Glass 박막에서 전기변색 속도 개선에 대한 연구를 수행하였다. 이는 선글라스의 변색속도가 수분 이상 소요되는 단점을 해결하고자 e-beam evaporator를 이용하여 니켈 금속 박막을 증착시킨 후, 전기화학적 산화-환원 반응으로 $Ni(OH)_2$에 대한 전기변색 특성을 연구하였다. 전기전도성을 갖는 ITO 에서보다 Glass 위에서의 $Ni(OH)_2$의 변색 속도가 오히려 빠르다. 이는 전위와 투과율을 측정함으로서 알 수 있다. XPS를 이용하여 Glass와 $Ni(OH)_2$ 사이의 초박막(${\sim}10{\AA}$) Ni 금속의 존재를 확인하였고, 이 나노 박막은 전기변색 장치의 응답 속도에 영향을 마쳤다. 기존의 선글라스가 5분 정도 소요되는 반면 니켈 나노 박막을 이용한 변색소자에서는 1~2초 정도 소요된다. 이론적으로는 수 ms 이내이지만 전기적 저항으로 인해 초 단위의 응답속도를 보이고 있다.

Improved optical switching property of electrochromic nickel hydroxide/nickel glass thin film is reported. Nickel metal film was deposited on glass by e-beam evaporation before following electrochemical redox cycling to form nickel hydroxide for electrochromic activation. Without ITO (indium tin oxide) layer as electrical conductor, this electrode showed more rapid coloration rate than nickel hydroxide film on ITO substrate in the change of the electric voltage and optical transmittance. XPS analysis confirmed the existence of ultra-thin nickel metal layer (${\sim}10{\AA}$) between electrochemically grown nickel hydroxide and the glass substrate. It is concluded that the remained nickel metal nano-layer attribute to the conduction layer and the enhanced response time.

An ultra-thin hexagonal microwave metamaterial absorber is described. It can absorb any polarized transverse electromagnetic wave because of its hexagonal shape. In spite of its very thin structure, almost $0.028{\lambda}g$, the absorber achieved 99% absorptivity at 11.35 GHz in experimental results because of the increased coupling losses, showing good agreement with simulation results. In addition, this high absorbance is unchanged for any polarized waves with the same frequency.

An ultra-thin reflective flexible LCD film has been demonstrated. The 30% thickness of the display can be reduced by applying a quarter-wave-plate film as upper substrate. A low temperature alignment material and special designed photo spacer were applied in this new display. The bending behavior was improved by reduced thickness.

We have carried out the fabrications of a barrier layer on a polyethersulfon (PES) film and organic light emitting diode (OLED) based on a plastic substrate by means of atomic layer deposition (ALD). Simultaneous deposition of 30 nm $AlO_x$ film on both sides of the PES film gave a water vapor transition rate (WVTR) of $0.062 g/m^2/day (@38^{\circ}C,\;100%\;R.H.)$. Further, the double layer of 200 nm $SiN_x$ film deposited by plasma enhanced chemical vapor deposition (PECVD) and 20 nm $AlO_x$ film by ALD resulted in a WVTR value lower than the detection limit of MOCON. We have investigated the OLED encapsulation performance of the double layer using the OLED structure of ITO / MTDATA (20 nm) / NPD (40 nm) / AlQ (60 nm) / LiF (1 nm) / Al (75 nm) on a plastic substrate. The preliminary life time to reach 91% of the initial luminance $(1300 cd/m^2)$ was 260 hours for the OLED encapsulated with 100 nm of PECVD-deposited $SiN_x$ and 30 nm of ALD-deposited $AlO_x$.

Fabrications of barrier layer on a polyethersulfon (PES) film and OLED based on a plastic substrate by atomic layer deposition (ALD) have been carried out. Simultaneous deposition of 30 nm of $AlO_x$ film on both sides of PES film gave film MOCON value of 0.0615 g/$m^2$/day (@38$^{\circ}C$, 100 % R.H.). Moreover, the double layer of 200 urn $SiN_x$ film deposited by PECVD and 20 nm of $AlO_x$ film by ALD resulted in the MOCON value lower than the detection limit of MOCON. The OLED encapsulation performance of the double layer have been investigated using the OLED structure of ITO/MTDATA(20 nm)/NPD(40 nm)/AlQ(60 nm)/LiF(1 nm)/Al(75 nm) based on the plastic substrate. Preliminary life time to 91 % of initial luminance (1300 cd/$m^2$) was 260 hours for the OLED encapsulated with 100 nm of PECVD deposited $SiN_x$/30 nm of ALD deposited $AlO_x$.

Fabrication of barrier layer on PES substrate and plastic OLED device by atomic layer deposition are carried out. Simultaneous deposition of 30nm of $AlO_x$ film on both sides of PES gives film MOCON value of 0.0615g/$m^2$.day (@38$^{\circ}C$, 100% R.H). Introduction of conformal $AlO_x$ film by ALD resulted in enhanced barrier properties for inorganic double layered film including PECVO $SiN_x$. Preliminary life time to 91% of initial luminance (1300 cd/$m^2$ ) for 100nm of PECVD $SiN_x$/30nm of ALD $AlO_x$ coated plastic OLED device was 260 hours.

In this paper, we report a novel RF-MEMS packaging technology with lightweight, small size, and short electric path length. To achieve this goal, we used the ultra thin silicon substrate as a packaging substrate. The via holes lot vortical feed-through were fabricated on the thin silicon wafer by wet chemical processing. Then, via holes were filled and micro-bumps were fabricated by electroplating. The packaged RF device has a reflection loss under 22 〔㏈〕 and a insertion loss of -0.04∼-0.08 〔㏈〕. These measurements show that we could package the RF device without loss and interference by using the vertical feed-through. Specially, with the ultra thin silicon wafer we can realize of a device package that has low-cost, lightweight and small size. Also, we can extend a 3-D packaging structure by stacking assembled thin packages.

A novel biomaterial capable of incorporating biotinylated biomolecule has been synthesized. Our strategy is to biotinylate one-dimensional electroactive polymers and use a bridging streptavidin protein on Langmuir-Blodgett (LB) organized films. These copolymers are derivatized with long alkyl chains and biotin moieties to bind, respectively, to the hydrophobic surface and the biotinylated species, through the biotin and streptavidin complexation. We utilize the polymer assembly approach to attach a signal transducing biomolecule biotinylated phycoerythrin (B-PE) into this novel biomaterial by binding the unoccupied biotin binding sites on the bound streptavidin (4 sites total). The pressure-area isotherm of the protein injected monolayer showed area expansion. A characteristic fluorescent emission peak at 576nm was detected from the monolayer transferred onto a solid substrate. These observations demonstrated the promise of the organized thin polymer assemblies for their application to the sensor system.