Earticle

Abstract 1. 서론 2. 기술개발의 내용 3. 작업조건의 측정 3.1 최적 회전속도 측정 3.2 속도와 래핑 시간 관계 3.3 생산량과 속도 관계 3.4 작업조건의 검증 4. 결론 참고문헌

The purpose of this paper was to provide the co-relation lapping conditions of a spectacle metal components. The main elements of lapping conditions were composed of rotation velocity, lapping time, graphite kinds, product quantity and faulty product ratio those were co-related and influenced at each other. The optimal working conditions of lapping were controled the each lapping conditions, mutual relations and reciprocal actions. It was studied the optimal lapping conditions those graphite kinds-rotation velocity-faulty product ratio, rotation velocity-lapping time, rotation velocity-product quantity. Based on these results, the optimal conditions were that the level of graphite was midiμm and rotation velocity was 40∼(60rpm.

Aluminum alloys are the light weight materials, they are commonly used in many industrial applications such as electronic, aerospace, automotive, and medical industry. Because they are used in these such applications. Therefore, their light weight and high surface quality are required. In this paper, the surface improvement round flat aluminum alloy using lapping finishing method was explored. In order to find the optimal condition, lapping parameters such as, rotational speeds, abrasive grain sizes of pad, processing times, and lapping oils were investigated in this study. The improvement in surface roughness was found to be highest with optimal condition at 200 rpm of rotational speed, 1 ㎛ abrasive grain size of pad, 0.5ml of light oil for 720 sec. By using the optimal condition, the initial surface roughness Ra of round flat aluminum alloy can be enhanced from 2.59㎛ to 0.02 ㎛. This can be concluded that the small CNC machine with lapping finishing method can be used to enhance the surface roughness of round flat aluminum alloy effectively.

Generally, the optical components are fabricated by grinding, lapping, and polishing. And, those processes take long time to obtain such a high surface quality. Therefore, in the case of large optical component, the on-machine inspection (OMI) is essential. Because, the work piece is fragile and difficult to set up for fabricating and measuring. This paper is concerned about a swing-arm method for measuring surface profile of large optical concave mirror. The measuring accuracy and uncertainty for suggested method are studied. The experimental results show that this method is useful specially in lapping process with the accuracy of $3\~5\;{\mu}m$. Those inspection data are provided for correcting the residual figuring error in lapping or polishing processes.

The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by Micro-lapping process. The sapphire crystalline wafers were characterized by double crystal X-ray diffraction. The sample quality of crystalline sapphire wafer at surface has a full width at half maximum of 250 arcsec. This value at the surface sapphire wafer surfaces indicated 0.12${mu}m$ sizes. Surfaces of sapphire wafers were mechanically affected by residual stress and surface default. As a result, the value of surface roughness of sapphire wafers measured by AFM(Atom Force Microscope) was 2.1nm.

This study has been focused on application of ELID lapping process for mirror-surface machining of sapphire wafer. Sapphire wafer is a superior material with optic properties of high performance as light transmission, thermal conductivity, hardness and so on. High effective surface machining technology is necessary to use sapphire as various usages. The interval ELID lapping process has been set up for lapping of the sapphire material. According to the ELID lapping experimental results, it shows that 12.5 kg of load for lapping is most pertinent to ELID lapping. the surface of sapphire can be eliminated by metal bonded wheel with micron abrasives and the surface roughness of 60 nmRa can be gotten using grinding wheel of 2,000 mesh in 4.5 um, depth of cut. In this study, the chemical experiments after ELID grinding also has been conducted to check chemical reaction between workpiece and grinding wheel on ELID grinding process. It shows that the chemical reaction has not happened as the results of the chemical experiments.

Application of ceramics, carbide, ferrite has grown considerably due to their mechanical properties such as high degree hardness, chemical stability, super wear resistance. Despite these characters, the use of advanced material has not increased because of poor machinability. The application of metal bonded wheel was proposed. But it is difficult that metal bond wheel can be dressed. Recently, to solve this problem, the technology of in-process electrolytic dressing is developed. This method need wheel for electrolytic dressing, power supply and electrolyte. The aim of this study is development of CIB-D wheel for electrolytic and its evaluation of electrolytic characteristics, and achieve ultra-precision lapping of carbide, optic glass.

Recently, application of ceramics has increased gradually due to excellent mechanical properties. Si3n4-BN ceramic which is one of ceramics is very hard and has superior resistance against volatile temperature and wear. However, extremely high hardness of the $Si_3N_4-BN$ ceramic makes conventional machining very difficult. Therefore, the use of machinable ceramic has been in a poor because of difficult industrial processes in spite of many advantages. And so new technology being called IED(In-process electrolytic dressing) was introduced to solve this problem. The aim of this study is to determine the machining characteristics in terms of pressurized weight to the workpiece and the influence with h-BN content using IED lapping system. Also, Acoustic Emission (AE) is used for the monitoring of surface characteristics.

Seamless object tracking in wide area is an important and yet challenging issue of intelligent visual surveillance multi-camera collaboration tracking approach has been becoming attractive. In this work, a flexible and integrated system is constructed for object tracking using multiple cameras either with overlapping fields of views (FOVs), non-overlapping FOVs or mixed configurations for wide areas surveillance. The Kalman filter is applied for object tracking in a single camera and object motion prediction is implemented across blind regions for non-overlapping FOVs. Furthermore, a client and server architecture is constituted using TCP/IP network. The FOV lines are used to guide camera switching. In addition, we integrate various features for object matching. Finally, this system can track objects in a wide area no matter the FOVs are overlapping, non-overlapping or mixed situations.

The damage of sawn, lapped, etched and polished wafers was evaluated by the angle lapping method and a biaxial fracture strength test. The Si wafers for analysis were fabricated by the commercial wafering process. As the wafering process proceeded, the depth of damage (DOD) measured by the angle lapping method decreased but the fracture strength measured by the ring-on-ring test increased. As a result, a correlation between DOD and fracture strength was verified using an equation for the fracture toughness, KIC. The fracture strength obtained from the ring-on-ring test was found to be one of the representative values for the mechanical properties of a wafer as it passed through the wafering process.

To investigate the mechanical behavior of column transfer structures enhanced by ceramic composite materials, thecharacteristics of the mountain shaped retreating terrace style lapping column transfer structure in a certain museum inHangzhou, one of the three-layer and three-bay lapping column was taken as the main research object. Static and quasistatictests were carried out respectively on 1:5 scale model specimens, and the static and quasi-static characteristics of themountain-shaped retreating terrace style lapping column transfer structure were analyzed. Finite element simulations werealso conducted to validate experimental observations. Results showed that under 1.2 times the design vertical load, thespecimen remained in the elastic range with no visible cracking, indicating excellent load-bearing capacity. Furthermore,the inclusion of ceramic materials significantly improved the hysteretic behavior and energy dissipation performance of thejoint under cyclic lateral loading. The peak inter-story drift ratio reached 1/28 without structural failure, meeting seismicperformance requirements. This study provides useful insights into the integration of ceramic-based composites in complexstructural transfer systems for improved resilience.

In ultra-precision machining of bearing rollers, pure rolling of the roller is generally required, but the motion characteristicsof ceramic rollers in the double-ring lapping method remain unclear. This study investigates the motion characteristicsof ceramic rollers in the double-ring lapping method, focusing on the contact relationships, contact conditions, contactdeformations and contact loads variation between the ceramic roller and the axial grooves on the inner ring and outer ring. A dynamic model for the double-ring lapping method is established and its accuracy is validated. The effects of inner ringspeed and lapping pressure on the roller’s motion characteristics are systematically analyzed. Results show that the dynamicmodel errors less than 6.5%, can be used to analyze the roller’s motion characteristics. Pure rolling between the ceramicroller and both the inner ring and outer ring can be achieved in the double-ring lapping method, with pure rolling occurringprimarily in the machining area. Ceramic rollers exhibit higher rolling stability at lower inner ring speeds, while lappingpressure has a smaller effect on motion stability. Rolling on the outer ring is more stable. This study provides theoreticalsupport for experimental research on ceramic roller machining using the double-ring lapping method.

In-process Electrolytic Dressing is a lapping method using electrolysis. This technology provides dressing to CIB-Diamond Lapping wheels during the lapping process for continuous protrude abrasive from super-abrasive wheels. so loading and glazing are disappeared apparently. Ultra-precision lapping of the machinable commies will be studied in the viewpoint of In-process Electrolytic Dressing. For ultra-precision lapping, need to develop an ultra-precision lapping system suitable metal bonded diamond wheel, and appropriate condition of u10a-precision lapping machining.

Application of ceramics, carbide, ferrite has grown considerably due to significant improvement in their mechanical properties such as light weight chemical stability super wear resistance and electronical. Despite these character, the use of hi-tech material has not increased because of poor machinability. The method of using of metal bond wheel was proposed. But it is difficult that metal bond wheel can be dressed. Recently, the technology of in-process electrolytic dressing is developed to solve this problem. This method need wheel for electrolytic dressing, power supply and electrolyte. But development of wheel for electrolytic dressing is the most need. The aim of this study is development of wheel for electrolytic and appraisement of CIB-diamond lapping wheel

Application of ceramics, carbide, ferrite has grown considerably due to significant improvement in their mechanical properties such as light weight, chemical stability , super wear resistance and electronical. Despite these character, the me of advanced material has not increased because of poor machinability. The method of using of metal bond wheel was proposed. But it is difficult that metal bond wheel can be dressed. Recently, the technology of in-process electrolytic dressing is developed to solve this problem. This method need wheel for electrolytic dressing, power supply and electrolyte. But development of wheel for electrolytic dressing is the most need. The aim of this study is development of wheel for electrolytic and appraisement of CIB-diamond lapping wheel

Diamond mechanical polishing (DMP) is a crucial process in a sapphire wafering process to improve flatness and achieve the target thickness by using free abrasives. In a DMP process, material removal rate (MRR) is a key factor to reduce process time and cost. Controlling mechanical parameters, such as velocity and pressure, can increase the MRR in a DMP process. However, there are limitations of using high velocities and pressures for achieving a high MRR owing to their side effects. In this paper, we present the lapping characteristics and improvement of MRR by using a fixed abrasive plate through an experimental study. The change in MRR as a function of velocity and pressure follows Preston's equation. The surface roughness of a wafer decreases as the plate velocity and pressure increases. We observe a sharp decrease in MRR over the lapping time at a high velocity and pressure in the velocity and pressure test. An analysis of surface roughness (Rq and Rpk) indicates that wear of abrasives decreases the MRR sharply. In order to investigate the effect of abrasive wear on the MRR, we utilize a cutting fluid and a rough wafer. The cutting fluid delays the wear of abrasives resulting in improvement of MRR drop. The rough wafer maintains the MRR at a stable rate by self-dressing.

Of typical welding techniques, to employ the heat for joining process is the most commonly used welding process. But there arise difficulties when this process is applied to light weight alloys such as Aluminium alloy. In this respect, Friction Stir Welding(FSW), a solid-state joining process, is the most effective welding technique with significant potential for various industrial applications. In this study, the characteristics of lapping FSW Al 5052 alloy are shown under a variety of welding parameters such as the rotation speed of FSW tool and welding velocity. Conclusively, the welding properties of lapping FSW Al 5052 were found to be dominated by the deformation of non-joining area near the welding nugget rather than other factors such as the thermal input.

Diamond mechanical polishing (DMP) is a crucial process in a sapphire wafering process to improve flatness and achieve the target thickness by using free abrasives. In a DMP process, material removal rate (MRR) is a key factor to reduce process time and cost. Controlling mechanical parameters, such as velocity and pressure, can increase the MRR in a DMP process. However, there are limitations of using high velocities and pressures for achieving a high MRR owing to their side effects. In this paper, we present the lapping characteristics and improvement of MRR by using a fixed abrasive plate through an experimental study. The change in MRR as a function of velocity and pressure follows Preston's equation. The surface roughness of a wafer decreases as the plate velocity and pressure increases. We observe a sharp decrease in MRR over the lapping time at a high velocity and pressure in the velocity and pressure test. An analysis of surface roughness (Rq and Rpk) indicates that wear of abrasives decreases the MRR sharply. In order to investigate the effect of abrasive wear on the MRR, we utilize a cutting fluid and a rough wafer. The cutting fluid delays the wear of abrasives resulting in improvement of MRR drop. The rough wafer maintains the MRR at a stable rate by self-dressing.