Li Hai-bin, Zhou Cun-long, Fan Xiao-ning, Kong Yi-gang, Huang Qing-xue, Ma Qin
언어
영어(ENG)
URL
https://www.earticle.net/Article/A293300
※ 원문제공기관과의 협약기간이 종료되어 열람이 제한될 수 있습니다.
원문정보
초록
영어
The bonding interface microstructure and mechanical property of clad plate with different hot rolling schedules were researched. The results show that the carbide layer thickness of bonding interface increases firstly and then decreases with increasing reduction ratio. The carbide layer of bonding interface is the major factor relating to tensile strength, so the experimental values of clad plate are slightly higher than the calculated ones. Moreover, the bending strength of clad plate is mainly influenced by the thickness ratio and the carbide quantity of SS, while the carbide layer thickness of bonding interface is an important factor affects the bending strength.
목차
Abstract 1. Introduction 2. Materials and Methods 3. Results 3.1. The Tensile Strength 3.2. Difference between Experimental and Calculated Values 3.3. Bending Strength 4. Conclusion
키워드
hot rolling; clad platemicrostructuremechanical property
저자
Li Hai-bin [ School of Material Science and Engineering, lanzhou University of Technology, lanzhou, China / School of Material Science and Engineering, Taiyuan University of Science and Technology,Taiyuan, China ]
Zhou Cun-long [ College of Mechanical Engineering,Taiyuan University of Science and Technology, Taiyuan, China ]
Fan Xiao-ning [ College of Mechanical Engineering,Taiyuan University of Science and Technology, Taiyuan, China ]
Kong Yi-gang [ College of Mechanical Engineering,Taiyuan University of Science and Technology, Taiyuan, China ]
Huang Qing-xue [ School of Material Science and Engineering, Taiyuan University of Science and Technology,Taiyuan, China ]
Ma Qin [ School of Material Science and Engineering, lanzhou University of Technology, lanzhou, China ]
보안공학연구지원센터(IJUNESST) [Science & Engineering Research Support Center, Republic of Korea(IJUNESST)]
설립연도
2006
분야
공학>컴퓨터학
소개
1. 보안공학에 대한 각종 조사 및 연구
2. 보안공학에 대한 응용기술 연구 및 발표
3. 보안공학에 관한 각종 학술 발표회 및 전시회 개최
4. 보안공학 기술의 상호 협조 및 정보교환
5. 보안공학에 관한 표준화 사업 및 규격의 제정
6. 보안공학에 관한 산학연 협동의 증진
7. 국제적 학술 교류 및 기술 협력
8. 보안공학에 관한 논문지 발간
9. 기타 본 회 목적 달성에 필요한 사업
간행물
간행물명
International Journal of u- and e- Service, Science and Technology
간기
격월간
pISSN
2005-4246
수록기간
2008~2016
십진분류
KDC 505DDC 605
이 권호 내 다른 논문 / International Journal of u- and e- Service, Science and Technology Vol.9 No.11