Earticle

초록

영어

Thermal insulation is used in a variety of applications to protect temperature sensitive products from thermal damage. Several factors affect the performance of insulation packages. Among these factors, the thermal resistance of the insulating wall is the most important factor to determine the performance of the insulating package. In many cases, insulating wall consists of multi-layered structure and the heat transfer through this structure is a very complex process. In this study, an one-dimensional mathematical model, which includes all of the heat transfer principles covering conduction, convection and radiation in multi-layered structure, were developed. Based on this model, several heat transfer phenomena occurred in the air space between the layer of the insulating wall were investigated. From the simulation results, it was observed that the heat transfer through the air space between the layer were dominated by conduction and radiation and the low emissivity of the surface of each solid layer of the wall can dramatically increase the thermal resistance of the wall. For practical use, an equation was derived for the calculation of the thermal resistance of a multi-layered wall.

목차

Abstract
 Introduction
 Theories
 Results and Discussion
  1. Characteristics of the heat transfer in multi-layered walls
  2. Development of the formula to calculate the R-valueof multi-layered wall structure
  3. Evaluation and refinement of the simplified equationusing computer program
 Conclusion
 REFERENCES

키워드

저자

• Seung Jin Choi [ School of Packaging, Michigan State University ] Corresponding Author

참고문헌

발행기관

간행물

표지보기 관심저널 등록

• 간행물명

  한국포장학회지 [Journal of Korea Society of Packaging Science & Technology]

• 간기

  연3회

• pISSN

  1226-0207

• 수록기간

  1994~2026

• 등재여부

  KCI 등재

• 십진분류

  KDC 530 DDC 620