Earticle

초록

영어

The temperature field distribution has a dominant influence on machining efficiency and surface quality during electrical discharge machining (EDM). The discharge location is strongly related to temperature field distribution. Thus, the effect of discharge location on temperature distribution during EDM process should be illustrated to understand the mechanism of temperature field distribution. In this study, the thermal model for EDM process is established using ANSYS software to investigate the temperature field distribution. The model considers more realistic factors such as Gaussian distribution of heat flux, plasma channel radius, latent heat of melting, etc., to agree with actual machining situation. Numerical simulation analysis of the temperature distribution of the two consecutive spark discharges has been carried out considering the relative position relation of discharge location. Based on the numerical simulation, the effect of discharge location on the temperature distribution and material removal volume in pulse discharge process has been analyzed in detail.

목차

Abstract
 1. Introduction
 2. Mathematical basis of the Thermal Model
 3. Results and Discussion
  3.1. The Choice of Discharge Location
  3.2 Simulation Results and Discussion
 4. Conclusions
 References

키워드

저자

• Baocheng Xie [ School of Mechanical and Power Engineering, Harbin University of Science and Technology, Harbin, Heilongjiang Province 150080, China ]
• Yanwen Zhang [ School of Mechanical and Power Engineering, Harbin University of Science and Technology, Harbin, Heilongjiang Province 150080, China ]
• Yuan Zhang [ School of Mechanical and Power Engineering, Harbin University of Science and Technology, Harbin, Heilongjiang Province 150080, China ]
• Ye Dai [ School of Mechanical and Power Engineering, Harbin University of Science and Technology, Harbin, Heilongjiang Province 150080, China ]
• Xianli Liu [ School of Mechanical and Power Engineering, Harbin University of Science and Technology, Harbin, Heilongjiang Province 150080, China ]

참고문헌

발행기관

간행물

표지보기 관심저널 등록

• 간행물명

  International Journal of Smart Home

• 간기

  격월간

• pISSN

  1975-4094

• 수록기간

  2008~2016

• 십진분류

  KDC 505 DDC 605