To understand the effect of fluid on thermal behavior of material removing in nanoscale, molecular dynamics (MD) simulation method is performed to model the chip generation, heat distribution, phase transformation and the temperature dependence by considering the effects of fluid during nanometric cutting of mono-crystalline silicon. In this work, a fluid containing model was used by considering fluids like coolants and concentrating on its impact during machining. The simulation results show that the chip size is 8% larger in vacuum than in the fluid containing model at the same simulation stage. In both case, the heat distribution topology is unanimous and roughly presents a concentric shape, a steep temperature gradient is observed in tool and the highest temperature lies in chip, but the average temperature is decreased of 6% in the low temperature ranges and 15% in chips of the fluid containing model. Phase transformation mainly occurred in chip, shear zone and machined surface, the growth of phase transformation is retarded by a volume decrease of 9% in the fluid containing model. Some physical quantities are decreased with the increasing system temperature during machining and show thermal soft effect.
목차
Abstract 1. Introduction 2. Simulation Methodology 3. Results and Discussion 3.1 Material Removing Characteristics 3.2 Heat Distribution 3.3 Phase Transformations 4. Conclusion Acknowledgements References
보안공학연구지원센터(IJCA) [Science & Engineering Research Support Center, Republic of Korea(IJCA)]
설립연도
2006
분야
공학>컴퓨터학
소개
1. 보안공학에 대한 각종 조사 및 연구
2. 보안공학에 대한 응용기술 연구 및 발표
3. 보안공학에 관한 각종 학술 발표회 및 전시회 개최
4. 보안공학 기술의 상호 협조 및 정보교환
5. 보안공학에 관한 표준화 사업 및 규격의 제정
6. 보안공학에 관한 산학연 협동의 증진
7. 국제적 학술 교류 및 기술 협력
8. 보안공학에 관한 논문지 발간
9. 기타 본 회 목적 달성에 필요한 사업
간행물
간행물명
International Journal of Control and Automation
간기
월간
pISSN
2005-4297
수록기간
2008~2016
십진분류
KDC 505DDC 605
이 권호 내 다른 논문 / International Journal of Control and Automation Vol.8 No.2