Earticle

초록

영어

In this study, the heat flow analysis compatible commercial code CFX 11 was used to develop the structure inside PCB circuit board devices, which could stable radiant heat as well as the cooling device within it. In case of modifying the arrangement of electronic parts on the PCB inside the multi channel temperature measurement board devices, radiant heat effects did not show a rising tendency, whereas the overall temperature went down in case of installing the vents in the outer case of PCB circuit board devices. In terms of installation location, it was the most appropriate to install it on the electronic parts with no heat. Besides, in case of mounting the fan as a cooling device by considering various user environments for multi channel temperature measurement board devices, the radiant heat effects were shown higher than in case of installing the vents, and the middle sections were the most appropriate to its installation location. In case of changing the wind quantity of the fan from its selected installation location, the best radiant heat effects were shown at high speed as expected.

목차

Abstract
 1. 서론
  1.2 연구목적
  1.3 연구내용
 2. 시스템구조
 3. 실험내용 및 결과
  3.1 PCB 회로기판의 전자부품 배치 변경
  3.2 통풍구 설치
  3.3 팬 설치에 따른 변화
 4. 결론
 5. 참고문헌

키워드

저자

• 원종운 [ Jong-Wun Won | 서남대학교 전자전기공학과 ]
• 이종휘 [ Jong-Hwi Lee | 군산대학교 기계공학부 ] Corresponding author

참고문헌

발행기관

간행물

표지보기 관심저널 등록

• 간행물명

  대한안전경영과학회지 [Journal of Korea Safety Management & Science]

• 간기

  계간

• pISSN

  1229-6783

• eISSN

  2288-1484

• 수록기간

  1999~2025

• 십진분류

  KDC 530 DDC 620