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Heat Reduction Scheme for Multimedia Display Device

첫 페이지 보기
  • 발행기관
    보안공학연구지원센터(IJMUE) 바로가기
  • 간행물
    International Journal of Multimedia and Ubiquitous Engineering SCOPUS 바로가기
  • 통권
    Vol.8 No3 (2013.05)바로가기
  • 페이지
    pp.319-326
  • 저자
    Junil Kim, Taehyun Jeon
  • 언어
    영어(ENG)
  • URL
    https://www.earticle.net/Article/A202302

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원문정보

초록

영어
The information technology is evolved to accomodate the ever changing end users request for new services. As the request for the high data rate multimedia contents explosively increases the related hardware, software and networking technologies are finding ways to effectively satisfy end users expectation. Aligned with this trend the display device becomes thinner to reduce the weight while supporting high resolution quality for both mobile and indoor usage. The LCD device is now an inevitable component in almost all the information processing appliances. The exothermic problem becomes one of the important issues which should be solved for various applications. In LCD adopted device the relative inside areas gets packed with various types of electronic devices as heat generation sources which include the display driver integrated circuit (IC). One of reasons for this problem is that more and more advanced display devices such as LCD and LED require driver ICs with higher degree of circuit integration within a limited area while demanding higher performances. Also a lot of efforts have been made to reduce the edge areas as the big screen display as well as portable mobile devices are getting popular in many fields. In this paper an enhanced heat sink method is proposed to reduce the heat generation problem caused by the driver ICs to maintain the stability of the operation and to protect the circuits in the chip on film package. The proposed method has advantages over the conventional ones in terms of the unit production price and no limitations on the arrangement of the IC.

목차

Abstract
 1. Introduction
 2. Proposed Exothermic Reduction Method
 3. Proposed Optimization Method
 4. Conclusion
 References

키워드

Display device driver IC heat sink chip on film package

저자

  • Junil Kim [ Seoul National University of Science and Technology, Dept. of Electrical and Information Engineering, 232 Gongneung-ro, Nowon-Gu, 139-743 Seoul, Korea ]
  • Taehyun Jeon [ Seoul National University of Science and Technology, Dept. of Electrical and Information Engineering, 232 Gongneung-ro, Nowon-Gu, 139-743 Seoul, Korea ] Corresponding author

참고문헌

자료제공 : 네이버학술정보

간행물 정보

발행기관

  • 발행기관명
    보안공학연구지원센터(IJMUE) [Science & Engineering Research Support Center, Republic of Korea(IJMUE)]
  • 설립연도
    2006
  • 분야
    공학>컴퓨터학
  • 소개
    1. 보안공학에 대한 각종 조사 및 연구 2. 보안공학에 대한 응용기술 연구 및 발표 3. 보안공학에 관한 각종 학술 발표회 및 전시회 개최 4. 보안공학 기술의 상호 협조 및 정보교환 5. 보안공학에 관한 표준화 사업 및 규격의 제정 6. 보안공학에 관한 산학연 협동의 증진 7. 국제적 학술 교류 및 기술 협력 8. 보안공학에 관한 논문지 발간 9. 기타 본 회 목적 달성에 필요한 사업

간행물

  • 간행물명
    International Journal of Multimedia and Ubiquitous Engineering
  • 간기
    월간
  • pISSN
    1975-0080
  • 수록기간
    2008~2016
  • 등재여부
    SCOPUS
  • 십진분류
    KDC 505 DDC 605

이 권호 내 다른 논문 / International Journal of Multimedia and Ubiquitous Engineering Vol.8 No3

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