The ACF(Anisotropic Conductive Film) is used for bonding Drive IC and OLED display device panel. If ACF bonding process is problem, a malfunction of line defect can occur. Because electric resistance increase between the panel and drive IC after a period of time, drive IC can not supply enough current to the panel. This paper is studied on a method of test for line defect.
목차
Abstract 1. 서론 1.1 연구의 목적 1.2 연구방법 및 범위 2. 이론적 배경 2.1 COG용 ACF 2.2 OLED Display Device의 고장 2.3 COG 본딩의 고장 모드/메카니즘 2.4 고장 스트레스 3. 실험방법 4. 실험 결과 및 검증 5. 결론 6. 참고문헌