Earticle

Freezing of the pure water saturating a packed bed of spheres in a rectangular cavity is performed experimentally to investigate the effect of bead diameter on the heat transfer rate and temperature vs. time history for the pure water freezing experiments were compared with the freezing of the binary solution(HO-NaCl). Spherical soda-lime glass beads of 2.85mm and 6mm in average diameter constitute the porous medium. The system is cooled through its bottom surface, and the top is maintained at a temperature above the liquids. There was small effect on the temperature distribution in the system of the porosity difference.

In this study, we developed nonvolatile residue (NVR) real-time monitoring system to measure the nonvolatile residue particle in ultra pure water (UPW). This device has a capability of measuring 4 different channels, i.e., 10 nm, 30 nm, 50 nm, and 100 nm. Until now, the light scattering method to detect RAE(residue after evaporation) was the only choice. However, this method can detect RAE larger than ca. 50 nm. In ultra pure water, RAE particles are usually very small and hard to detect with conventional laser scattering devices. To detect very small RAEs, a new system is developed and tested. The system consists of an atomizer that generates RAE particles and a four channel condensation particle counter (CPC). During the several months' operation in manufacturing line, the system was successfully tested and showed reliable results.

Since 1980, the water quality of ultra-pure water has been rapidly improved, and presently ultra-pore water producing equipment for 64Mbit is in operation. Table 1 shows the degree of integration of DRM and required water quality exlmple. The requirements of the ultra-pure water for 64Mbit are resistivity: 18.2 MQ/cm or higher, number of particulates: 1 pc/ml or less (0.05 $\mu$m or larger). bacteria count: 0.1 pc/l or less. TOC (Total Organic Carbon, index of organic snbstance) : 1ppb or less, dissolved oxygen: 5ppb or less, silica: 0.5ppb or less, heavy metal ions: 5ppb or less. The effect of metals on the silicon wafer has been well known, and recently it has been reported that the existence of organic substance in ultra-pure water is closely related to the device defect, drawing attention. It is reported that if organic substance sticks to the natural oxidation film, the oxide film remaims on the organic substance attachment in the hydrofluoric acid treatment (removal of natural oxidation film). The organic substance forms film on the silicon wafer, and harmful elements such as metals and N.P.S., components contained in the organic substance and the bad effect due to the generatinn of silicon carbide cannot be forgotten. In order to remove various impurities in raw water, many technological develoments (membrane, ion exchange, TOC removal, piping material, microanalysis, etc.) have been made with ultra-pure water producing equipment and put to practical use. In this paper, technologies put to practical use in recent ultra-pure vater producing equimeut are introduced.

For ultra-pure water, the removal of various impirities is required, and the requirement level is rising year by year. To cope with this problem, various removing technologies and system technologies have been developed and the introduction of new materials for the piping, etc. to form the system have been positively made. For the element technologies to be used for ultra-pure water production, their range will be expanded from the technological and economic viewpoints. Therefore, it is absolutely necessary to develop trace analysis evaluation technologies for ultra-pure water. Especially to raise the analytical level of heavy metals and organic substances is important. It is also important to establish individual analysis methods of organic substances. It is expected that the analytical methods will be established and new treating methods will be put to practical use in the near future.

The hydrolysis of penicillin G, carbenicillin and ampicillin in pure water at room temperature was studied by high pressure liquid chromatography electrospray ionization mass spectrometry. Hydrolysis of ampicillin did not occur under these conditions; however, penicillin G and carbenicillin were completely hydrolyzed after seven days. A short interpretation of this difference is proposed. The mass spectrometric behaviour, namely ESI response and fragmentation pathway, of hydrolyzed penicillin G and hydrolyzed carbenicillin have been also discussed.

The effect of annealing on the pitting corrosion resistance of anodized Al-Mg alloy (AA5052) processed by equal-channel angular pressing (ECAP) was investigated by electrochemical techniques in a solution containing 0.2 mol/L of $AlCl_3$ and also by surface analysis. The Al-Mg alloy was annealed at a fixed temperature between 473 and 573 K for 120 min in air after ECAP. Anodizing was conducted for 40 min at $100-400A/m^2$ at 293 K in a solution containing 1.53 mol/L of $H_2SO_4$ and 0.0185 mol/L of $Al_2(SO_4)_3$. The internal stress generated in anodic oxide films during anodization was measured with a strain gauge to clarify the effect of ECAP on the pitting corrosion resistance of anodized Al-Mg alloy. The time required to initiate the pitting corrosion of anodized Al-Mg alloy was shorter in samples subjected to ECAP, indicating that ECAP decreased the pitting corrosion resistance. However, the pitting corrosion resistance was greatly improved by annealing after ECAP. The time required to initiate pitting corrosion increased with increasing annealing temperature. The strain gauge attached to Al-Mg alloy revealed that the internal stress present in the anodic oxide films was compressive stress, and that the stress was larger with ECAP than without. The compressive internal stress gradually decreased with increasing annealing temperature. Scanning electron microscopy showed that cracks occurred in the anodic oxide film on Al-Mg alloy during initial corrosion and that the cracks were larger with ECAP than without. The ECAP process of severe plastic deformation produces large internal stresses in the Al-Mg alloy; the stresses remain in the anodic oxide films, increasingthe likelihood of cracks. It is assumed that the pitting corrosion is promoted by these cracks as a result of the higher internal stress resulting from ECAP. The improvement in the pitting corrosion resistance of anodized AlMg alloy as a result of annealing appears to be attributable to a decrease in the internal stresses in anodic oxide films

A life-cycle assessment (LCA) is based on the attention given to the environmental protection and concerning the possible impact while producing, making, and consuming products. It includes all environmental concerns and the potential impact of a product's life cycle from raw material procurement, manufacturing, usage, and disposal (that is, from cradle to grave). This study assesses the environmental impact of the ultra pure water process of semiconductor manufacturing by a life-cycle assessment in order to point out the heavy environmental impact process for industry when attempting a balanced point between production and environmental protection. The main purpose of this research is studying the development and application of this technology by setting the ultra pure water of semiconductor manufacturing as a target. We evaluate the environmental impact of the Precoat filter process and the Cation/Anion (C/A) filter process of an ultra pure water manufacturing process. The difference is filter material used produces different water quality and waste material, and has a significant, different environmental influence. Finally, we calculate the cost by engineering economics so as to analyze deeply the minimized environmental impact and suitable process that can be accepted by industry. The structure of this study is mainly combined with a life-cycle assessment by implementing analysis software, using SimaPro as a tool. We clearly understand the environmental impact of ultra pure water of semiconductor used and provide a promotion alternative to the heavy environmental impact items by calculating the environmental impact during a life cycle. At the same time, we specify the cost of reducing the environmental impact by a life-cycle cost analysis.

반도체 소자 제조 공정이 고 집적화 됨에 따라 습식 세정방법에 의한 세정공정의 중요성이 더욱 증가 되어지고 있으며, 특히 그 중에서 전체 세정공정의 약 절반을 차지하고 있는 Deionised water에 의한 rinsing 공정의 경우 ultrapure water의 quality가 최근 지속적으로 향상이 되어짐에 따라 많은 발전을 자져 왔다. 일반적으로 Deionised water에 함유하고 있는 TOC(total oxidisable components), bacteria, metallic impurity, desolved oxygen cencentration, colloidal material impurity (예를 들면 Silica, oraganic substrate)등은 ultra pure water의 quality를 결정하는데 매우 중요한 factor로 작용하고 있으며, 이러한 불순물들이 반도체 제조공정중 wafer surface에 흡착되어 졌을때 여러형태의 defect들을 유발한다고 알려져 있다. 그러나 pseudommonas, flavobacterlum, alcaligene등의 기 얄려진 bacteria들의 경우 Deionised water를 supply해주는 배관의 Inner surface에 잘 흡착 되지만 고온의 water 혹은 과산화수소수($H_{2}O_{2}$) 를 이용하여 주기적으로 처리 해줌으로 인하여 이에 대한 문제점을 어느정도 최소화 시킬수 있다. 위의 두가지 방법중 전자의 경우 chemical을 사용하지 않고, 유지 및 관리가 간편하며, 용존산소량을 줄일수 있다는 점에서 장점이 있으나, 전 ultra pure water의 system이 열적으로 안정해야 하고 경제적인 문제가 수반하는 단점을 가지고 있다. 후자의 경우, 미량의 과산화수소수 (1~10,000 ppm)를 이용해 처리 해주는 방법의 경우 경제적으로 큰 장점이 있고, 처리가 단순하다는 장점이 있으나 과산화수소수 자체에 포함하고 있는 높은 impurit level, 그리고 처리후 장시간의 flushing time을 가져야 한다는 단점등이 존재 하고 있다.

In this study, for increasing the efficiency of solar collector, the thermal conductivities and viscosities of the pure water and ethanol oxidized multi-walled carbon nanofluids were measured. Nanofluids were manufactured by ultra-sonic dispersing oxidized multi-walled carbon nanotubes(OMWCNTs) in the pure-water and ethanol at the rates of 0.0005 ~ 0.1 vol%. the Thermal conductivities and viscosities of manufactured nanofluids were measured at the low temperature($10^{\circ}C$), the room temperature($25^{\circ}C$) and the high temperature($70^{\circ}C$). For measuring thermal conductivity and viscosity, we used Transient Hot-wire Method and Rotational Digital Viscometer, respectively. As a result, under given temperature conditions, thermal conductivity of the 0.1 vol% pure-water nanofluid improved 7.98% ($10^{\circ}C$), 8.34% ($25^{\circ}C$), and 9.14% ($70^{\circ}C$), and its viscosity increased by 37.08% ($10^{\circ}C$), 33.96% ($25^{\circ}C$) and 21.64% ($70^{\circ}C$) than the base fluids. Thermal conductivity of the 0.1 vol% ethanol nanofluids improved 33.72% ($10^{\circ}C$), 33.14% ($25^{\circ}C$), and 32.36% ($70^{\circ}C$), and its viscosity increased by 37.93% ($10^{\circ}C$), 31.92% ($25^{\circ}C$) and 29.42% ($70^{\circ}C$) than the base fluids.

The process optimization of ozone concentration and half life time was investigated in ultra pure water and alkaline solutions for the wet cleaning of silicon wafer surface at room temperature. In the ultra pure water,. the maximum concentration (35 ppm) of ozone was measured at oxygen flow rate of 3 liters/min and ozone generator power over 60%. The half life time of ozone increased at lower power of ozone generator. Additive gases such as $N_2$ and $CO_2$ were added to increase the concentration and half life time of ozone. Although the maximum ozone concentration was higher with the addition of $N_2$ gas, a longer half life time was observed with the addition of $CO_2$. When $NH_4OH$ of 0.05 or 0.10 vol% was added in DI water, the pH of the solution was around 10. The addition of ozone resulted in the half life time less than 1 min. In order to maintain high pH and ozone concentration, ozone was continuously supplied in 0.05 vol% ammonia solutions. 3 ppm of ozone was dissolved in ammonia solutions. The static contact angle of silicon wafer surface became hydrophilic. The particle removal was possible alkaline ozone solutions. The organic contamination can be removed by ozonated ultra pure water and then alkaline solution containing ozone can remove the particles on silicon surface at room temperature.

According to a report in 2011, hexagonal boron nitride demonstrated good solubility in pure water, even without surfactants or organic functionalization. Hexagonal boron nitride nanosheets are an effective lubricant additive, and their solubility in pure water has motivated lubrication engineers to utilize aqueous solutions containing these nanosheets as water-based lubricants. In this study, we measure the width and height of the hexagonal boron nitride nanosheets dispersed in pure water by using the Zetasizer and atomic force microscopy. Without surfactants or functionalization, aqueous solutions containing 0.10, 0.07, 0.05, and 0.01 wt% of hexagonal boron nitride nanosheets are synthesized via sonication-assisted hydrolysis. The Zetasizer provides only a one-dimensional size of approximately 410 nm, regardless of the concentration of the solution. Thus, it does not allow the estimation of the shape of the nanosheet. To acquire the three-dimensional size of the nanosheets, atomic force microscopy is employed. The aqueous solutions containing 0.10, 0.07, 0.05, and 0.01 wt% of the hexagonal boron nitride nanosheets show average values of 740, 450, 700, and 610 nm in width, and 37, 26, 33, and 32 nm in thickness, respectively. No significant trend is observed between the concentration of the solution and size of the nanosheets. Therefore, when preparing a water-based lubricant, it may be appropriate to adjust conditions such as ultrasonication time rather than the concentration.

본 연구에서는 천이유동의 존재를 밝히고 천이영역과 경사각의 관계, 유동 및 열전달특성을 구명하고자 한다.이를 위해 유한차분방법(FDM)으로 수치해석하고 실 험결과와 비교, 검토하였다.

A basic study on the discharge phenomenum of rod-to-rod microgap in the deionized water has been investigated with emphasis on the microgap spacing. The I-V charateristics for the case of ac and dc applied voltages had 3 different regions, a low conduction ohmic region, a medium conduction corona discharge region, and a high conduction arc discharge region. The corona discharge in the deionized water for the case of ac and de applied voltages had no different from the those in the air. But the arc discharge in the water occurred pulsative with sound which, however it is not clear, would be encounted due to the influences from the low temperature of the ambient water, vast of electrolytic generated electronegative gases(e.g. $O_2$, OH, O) and water molecules($H_2O$), and the space charge effects near the rod in the microgap from the ions of $H^+$, $OH^-$, $O_2^-$, etc, whose mobilities in the water are originally very low.

본 연구에서는 저온의 순수물 속의 등온 수직원기둥에 의해 야기되는 열전달 특성을 구명함에 있어서 짧은 원기둥 범주에 속하는 종횡비 0.5인 얼음 원기둥을 이용 하여 실험적으로 열전달 특성을 구명하였다. 그리고 전 유동장을 가시화 하였으며, 얼음의 융해율로써 누셀트(Nusselt)수를 측정하여 기존의 결과들과 비교검토하였다.