Earticle

Recently, the analysis of microcutting with submicrometer depth of cut is tried to get a more high quality surface product, but to get a valuable result another method instead of conventional finite element method must be considered because finite element method is impossible for a very small focused region and mesh size. As the alternative method, Molecular Dynamics or Statics is suggested and accepted in the field of microcutting, indentation and crack propagation. In this paper using Molecular Dynamics simulation, the phenomena of microcutting with subnanometer chip thickness is studied and the cutting mechanism for tool edge configuration is evaluated. As the result of simulation the atomistic chip formation is achieved.

Recently, the analysis of microcutting with submicrometer depth of cut is tried to get a more high quality surface product, but to get a valuable result another method instead of conventional finite element method must be considered because finite elment method is impossible for a very small focused region and mesh size. As the altermative method, Molecular Dynamics or Statics is suggested and acceoted in the field of microcutting, indentation and crack propagation. In this paper using Molecuar Dynamics simulation, the phenomena of microcutting with subnanometer chip thickness is studied and the cutting mechanism for tool edge configuration is evaluated. As the result of simulation the atomistic chip formation is achieved.

It is well known that abrasive waterjet(AWJ) was developed as a kind of high-density energy processing technologies. AWJ is used to obtain the better cutting quality of various materials such as metals, ceramics, glass and composite materials within a short manufacturing time because of the characteristics of heatless and noncontact processing. However, AWJ device still has some problems to obtain the high quality of thin workpiece. In this paper, we investigated the optimal microcutting conditions of AWJ, such as maximum pressure, cutting speed and standoff distance of thin multi-layered materials. The experimental results show that AWJ has possibilities and potential to apply to the microcutting of thin multi-layered materials for IT industrial applications.