Earticle

Toilet liquid-type cleaners utilize operating technology that employs buoyancy mechanism to inject uniform amount of cleaning solution. Flow characteristics of velocity and pressure distributions in the flow field of toilet flush cleaner injection device have been analyzed with CFD method. The flow rate decreases near the inlet of the system, where it contacts the container of the cleaning liquid bottle. It then increases near the injection device stopper and decreases again as it moves toward the system outlet The height of the cleaning solution decreases from 12 cm to 3 cm when using the spray device, the average outlet velocity decreases by approximately 73%. The solution level difference increases from 1.616 cm to 3.216 cm, the inlet velocity decreases by approximately 4.1%~5.6%. These predicted results can be widely applied as basic conceptual design data for highly efficient toilet flush cleaner injection device.

This study aimed at comparing the performance of imported LX detergent cleaning solution (LX-CS) and the self-manufactured OC cleaning solution (OC-CS), based on functional and quantitative analysis. The functional analysis was carried out using apparent diffusion coefficient (ADC) values. For quantitative analysis, precision, linearity, and carry-over rates were measured with commercial control materials according to the Clinical and Laboratory Standards Institute (CLSI) guidelines. Using OC-Sensor PLEDIA (Eiken Chemical, Japan), the ADC value of all cuvettes satisfied the acceptance criteria. For quantitative analysis, precision was less than 5.0% for the two products, and carry-over rates were less than ±1.00%. The linearity slopes and r2 values were 1.0017 and 0.9982 in the LX-CS, and 0.9924 and 0.9996 in the OC-CS, respectively. The correlation coefficient (r) was found to be 0.9997. Also, the percent difference in correlation with 40 artificial-stool specimens was less than 10% and the p-value was less than 0.1. The result of standard deviation ratio (D: ±1 SD ratio) was similar for both products. In conclusion, the functional and quantitative analyses of the two products were compared and showed similar results. In the future, the self-manufactured OC-CS will be able to provide a much more stable and faster supply than the imported LX-CS.

Copper(Cu) as an interconnecting metal layer can replace aluminum (Al) in IC fabrication since Cu has low electrical resistivity, showing high immunity to electromigration compared to Al. However, it is very difficult for copper to be patterned by the dry etching processes. The chemical mechanical polishing (CMP) process has been introduced and widely used as the mainstream patterning technique for Cu in the fabrication of deep submicron integrated circuits in light of its capability to reduce surface roughness. But this process leaves a large amount of residues on the wafer surface, which must be removed by the post-CMP cleaning processes. Copper corrosion is one of the critical issues for the copper metallization process. Thus, in order to understand the copper corrosion problems in post-CMP cleaning solutions and study the effects of DC biases and post-CMP cleaning solution concentrations on the Cu film, a constant voltage was supplied at various concentrations, and then the output currents were measured and recorded with time. Most of the cases, the current was steadily decreased (i.e. resistance was increased by the oxidation). In the lowest concentration case only, the current was steadily increased with the scarce fluctuations. The higher the constant supplied DC voltage values, the higher the initial output current and the saturated current values. However the time to be taken for it to be saturated was almost the same for all the DC supplied voltage values. It was indicated that the oxide formation was not dependent on the supplied voltage values and 1 V was more than enough to form the oxide. With applied voltages lower than 3 V combined with any concentration, the perforation through the oxide film rarely took place due to the insufficient driving force (voltage) and the copper oxidation ceased. However, with the voltage higher than 3 V, the copper ions were started to diffuse out through the oxide film and thus made pores to be formed on the oxide surface, causing the current to increase and a part of the exposed copper film inside the pores gets back to be oxidized and the rest of it was remained without any further oxidation, causing the current back to decrease a little bit. With increasing the applied DC bias value, the shorter time to be taken for copper ions to be diffused out through the copper oxide film. From the discussions above, it could be concluded that the oxide film was formed and grown by the copper ion diffusion first and then the reaction with any oxidant in the post-CMP cleaning solution.

PURPOSE. The purpose of this study was to analyze the antimicrobial, antioxidant activity and cytotoxicity of Dendropanax morbifera $L{\acute{e}}veille$ extract for assessing whether Dendropanax morbifera $L{\acute{e}}veille$ can be used for the development of natural mouthwash and denture cleaning solution. MATERIALS AND METHODS. The extract was obtained from branches of Dendropanax morbifera $L{\acute{e}}veille$. The solvent fractions were acquired by fractionating Dendropanax morbifera $L{\acute{e}}veille$ extract using n-hexane, ethyl acetate, chloroform and butanol solvent. Paper disc test was used to evaluate the antimicrobial and antifungal activity of Dendropanax morbifera $L{\acute{e}}veille$ extract and solvent fractions against Streptococcus mutans and Candida albicans. The analysis of antioxidant activity was carried out through DPPH radical scavenging assay. The cytotoxicity of Dendropanax morbifera $L{\acute{e}}veille$ extract was analyzed through MTT assay using normal human oral keratinocytes. RESULTS. Dendropanax morbifera $L{\acute{e}}veille$ extract showed antimicrobial activity against Streptococcus mutans and especially Candida albicans. The solvent fractions of Dendropanax morbifera $L{\acute{e}}veille$ showed strong antimicrobial activity against Streptococcus mutans and Candida albicans in n-hexane and butanol solvent fraction, respectively. Dendropanax morbifera $L{\acute{e}}veille$ extract also showed outstanding antioxidant activity. Butanol, ethyl acetate, and chloroform solvent fraction of Dendropanax morbifera $L{\acute{e}}veille$ tended to have increased antioxidant activity as the concentration increased. Dendropanax morbifera $L{\acute{e}}veille$ extract showed high cell survival rate in cytotoxicity test. CONCLUSION. Dendropanax morbifera $L{\acute{e}}veille$ extract turned out to have antimicrobial, antioxidant activity and cytophilicity. Based on these results, it is expected that Dendropanax morbifera $L{\acute{e}}veille$ is applicable as an ingredient for natural mouthwash and denture cleanser.

Background/Aims: Unsedated transnasal esophagogastroduodenoscopy (EGD) is affected by a poor scope lens-cleaning function. We have previously reported good, albeit limited, effects of an oolong tea washing solution; here, we evaluated the effectiveness of a 5%lens cleaning solution for cleaning an EGD lens. Methods: Five percent lens cleaning solution (C), 5% dimethicone solution (D), and distilled water (W) were prepared. Study I:Lenses were soiled with pork grease, washed with each washing solution, and their image quality was judged. Study II: Patients (n=996)scheduled for transnasal EGD were randomly assigned to the C- or W-group. Lens cleanliness level, washing solution volume used,and endoscopist stress due to lens contamination were determined. Results: Study I: The image quality of the lenses washed with (C) was significantly superior. (D) was clinically unsuitable because ofspray nozzle clogging. Study II: Lens cleaning in the C-group was significantly superior (p<0.0001) and the solution volume requiredwas significantly reduced (p<0.0001), while endoscopist stress was also lower (p<0.0001). Conclusions: For transnasal small-caliber EGD, the present 5% lens cleaning solution provided good visibility. It features a highdetergency level and is simple to formulate for therapeutic endoscopy applications, such as endoscopic submucosal dissection.

Chemical mechanical polishing (CMP) is a planarization process that mechanically removes the chemically reacted surface layer of a wafer using abrasives, thus playing a crucial role in enhancing the integration density of modern semiconductor devices. However, ensuring that all abrasives are completely removed during the post-CMP cleaning process before advancing to subsequent steps is critical. This study utilizes the improved smoothed particle hydrodynamics method to analyze the flow of a cleaning solution during post-CMP cleaning under varying brush and wafer rotation speeds. With a 3-mm gap between the brush and wafer, the velocity of the cleaning solution is found to be highly dependent on the wafer’s rotation speed, whereas the brush’s effect on flow velocity is relatively minor. In addition, the pressure of the cleaning solution tends to increase over the duration of the post-CMP cleaning, peaking at a brush rotation speed of 200 rpm. Future studies should investigate the variations in cleaning solution velocity and pressure under different brush? wafer gap conditions, as well as the effects of changes in brush and wafer rotation speeds. Research into double-sided brush cleaning, which is employed in actual post-CMP cleaning processes, is also expected to be necessary.

The post cleaning method for clean the shadow mask using in OLED (organic light emitting diode) emitter layer is always reforming. The cleaning solution and analysis method of shadow mask is still lack and not optimized. We use the simple and useful analytical method to determine the quantity and quality of organic and inorganic residue on surface of shadow mask. Finally analyze the cleaning solution using Raman spectroscopy efficiently.

산업체에서 부품을 가공하거나 완성품을 제조하는 과정에서 세정 공정은 필수적으로 사용하고 있고 현재 국내외 대부분의 제조업체에서는 오존파괴물질인 CFC-113이나 1,1,1-TCE 대신에 보다 환경친화적인 수계 세정제로의 대체가 진행중이다. 그러나 수계 세정시스템은 세정공정이나 헹굼공정에서 다량의 물을 사용하기 때문에 많은 폐수를 발생시키는 단점이 있다. 따라서 수계 세정시스템에서는 이러한 발생을 최소화하고 세정액과 헹굼수의 성능을 오랫동안 유지시키기 위한 모니터링 기술과 재활용 기술의 도입이 긴요하다. 본고에서는 수계 세정시스템에 사용하는 세정제와 주요 오염물질인 절삭유를 조사 분석하였고 산업현장에서 도입 가능한 수계 세정시스템의 모니터링 기술과 재활용 기술 등을 분석 평가하였다.

Cleaning process is necessary for machining parts or manufacturing finished products in the industry. Most of domestic and foreign companies are now trying to adopt environment-friendly aqueous cleaning agents instead of CFC-113 and 1,1,1-TCE which are ozone-depleting substances. However, the aqueous cleaning system has a disadvantage due to its generation of lots of waste water since the system utilizes water in cleaning and rinsing processes. Thus, it is very important that monitoring and recycling technologies of the cleaning solution and the rinse water should be introduced in the aqueous cleaning system in order to minimize generation of waste water and to maintain its cleaning performance for a quite long time. In this paper, the cleaning agents utilized in the aqueous cleaning system and cutting oils which are main contaminants were examined and analyzed. And the monitoring and recycling technologies of the aqueous cleaning system which can be employed in the industrial fields were also reviewed and evaluated.

The surface of silicon dummy wafers is contaminated with metallic impurities owing to the reaction with and adhesion of chemicals during the oxidation process. These metallic impurities negatively affect the device performance, reliability, and yield. To solve this problem, a wafer-cleaning process that removes metallic impurities is essential. RCA (Radio Corporation of America) cleaning is commonly used, but there are problems such as increased surface roughness and formation of metal hydroxides. Herein, we attempt to use a chelating agent (EDTA) to reduce the surface roughness, improve the stability of cleaning solutions, and prevent the re-adsorption of impurities. The bonding between the cleaning solution and metal powder is analyzed by referring to the Pourbaix diagram. The changes in the ionic conductivity, H2O2 decomposition behavior, and degree of dissolution are checked with a conductivity meter, and the changes in the absorbance and particle size before and after the reaction are confirmed by ultraviolet-visible spectroscopy (UV-vis) and dynamic light scattering (DLS) analyses. Thus, the addition of a chelating agent prevents the decomposition of H2O2 and improves the life of the silicon wafer cleaning solution, allowing it to react smoothly with metallic impurities.

Damascene 구조를 갖는 반도체소자의 구리금속배선 식각공정에서 배선재료에 의해서 발생되는 구리 식각잔류물을 제거하기 위해 oxalic acid (OA), lactic acid (LA) 및 citric acid (CA)의 카르복시산 함유된 반수계 혼합세정액을 제조하고 특성을 분석하였다. 카르복시산은 pH에 따라 카르복실기와 구리이온들과의 다양한 복합체를 형성하며 세정특성의 변화를 준다. 카르복시산들이 함유된 각각의 세정액의 세정특성평가결과 10 wt% CA를 함유한 반수계 세정액의 식각잔류물 세정특성은 pH 2에서 7까지의 영역에서 가장 낮은 구리 식각률을 보였으며 pH 2에서 4까지 구리에 대한 구리산화물의 가장 높은 식각 선택도를 나타내었으나 pH 5에서 7 범위에서는 10 wt% LA가 함유된 세정액이 더 높은 선택도를 보였다. 따라서 표면세정효과는 pH에 따라 변화하며 적절한 카르복시산을 사용함이 요구된다. CA가 함유된 세정액의 경우에 CA 농도와 구리에 대한 구리산화물의 식각 선택도의 증가특성을 보이며 CA가 5 wt%이상 함유된 경우에는 세정 후 구리배선의 표면이 88 %이상의 금속구리로 분석되어 구리산화물로 구성된 식각 잔류물의 제거에 효과적임을 알 수 있었다.

In this study, semi-aqueous solutions containing carboxylic acids such as oxalic acid (OA), lactic acid (LA) and citric acid (CA) were formulated for the removal of copper etching residues produced at the interconnection process, and their characteristics were analyzed. Carboxylic acids in the solutions were apt to form various copper complexes according to the value of pH. Semi-aqueous solution containing 10 wt% CA showed the lowest etching rate of copper in the range from pH2 to pH7 and the highest selectivity in the range of pH 2 to pH 4. However, the cleaning solution containing 10 wt% LA revealed the superior selectivity at the range from pH 5 to pH 7. Appropriate selection of carboxylic acid should be required to improve the performance of cleaning solution. In the case of CA, the etching selectivity of copper oxide complex to copper was increased with the concentration of CA in the solution, when the solutions contain over 5 wt% CA, the copper interconnection layer has a metallic copper surface more than 88% in the area. The result shows that CA contained semi-aqueous solution has a relatively good cleaning ability.

현 국제해사기구(IMO)에서의 선박엔진에서 발생되는 NOx와 SOx 등의 연소 가스 배출에 대한 규제 강화에 따라, 발트 해 연안을 지나는 모든 선박들은 배출되는 연소가스 저감장치를 장착해야 된다. 국내에서도 IMO의 규제에 따른 NOx와 SOx를 저감장치를 개발하고 있으며, 그중에 대표적인 장치인 Scrubber는 세정액으로 암모니아수와 요소수를 사용하게 되고 사용된 폐 세정액에는 NOx와 SOx와 반응한 질산암모늄과 황산암모늄이 포함되어 있다. 본 연구에서는 폐 세정액이 포함하고 있는 유용한 부산물을 유기용매를 사용하는 염석법을 적용하여 회수하였다. 질산암모늄과 황산암모늄의 회수방법과 질안석회를 추출 후 회수된 부산물의 정성분석을 위하여, FT-IR 분석을 통하여 물질의 정성적 특성과 화학적 조성을 평가해 보았다. 한편 응집제를 투입하여 질안석회를 침전시켜 비료상의 물질로 회수하였다. $FeSO_4$ 응집제와 $CaCl_2$를 응집보조제로 사용하고 입자의 크기를 키우기 위해 $CaCO_3$를 사용하였다.

The International Maritime Organization (IMO) in accordance with the regulations with respect to the combustion gases, such as NOx, SOx generated by the marine engine. The combustion gases must be equipped with a device to reduce emissions from all ships passing through the Baltic SECAs. In Korea, the International Maritime Organization (IMO) and the development of a device for NOx, SOx reduction. Scrubber is used in the ammonia water and the Urea solution in the waste water. The waste water containing ammonium nitrate and ammonium sulfate, react of the NOx and SOx gas. In this study, the recovery of by-product, which contains the waste water was used as an organic solvent extraction method of salting out. Ammonium nitrate and ammonium sulfate, the recovery process. A qualitative analysis of the collected by-product FT-IR analysis. Through the elemental analysis and SEM-EDS, characteristic evaluation was performed with an impurity.

반도체 공정에서 구리 배선 공정의 도입에 따라 플라즈마 식각에 의해 배선의 형성과정에서 구리 산화물, 불화물 및 불화탄소 등을 포함한 복합 잔류물을 형성하게 된다. 본 연구에서는 아민기(-NH₂)와 카르복실기(-COOH)를 갖는 성분으로 세정액을 제조하여 구리 배선 공정에서의 식각 잔류물 제거 특성을 분석하였다. 아민기를 포함한 세정액은 질소에 치환된 성분 및 탄소결합의 길이에 따라 세정효과에 차이를 보이며, 세정액의 pH가 증가함에 따라 구리 산화물의 식각 속도가 증가하는 경향성을 보였다. 아민기의 활성은 염기성 영역에서, 카르복실기의 활성은 산성 영역에서 이루어지며, 각각의 영역에서 구리 또는 구리 산화물과의 complex 형성을 통하여 세정공정이 진행되었다.

With the copper interconnection in the semiconductor process, complex residues including copper oxide, fluoride, and polymeric fluorocarbon are formed by plasma etching. In this study, a cleaning solution was prepared with a component having an amine group (-NH₂) and a carboxyl group (-COOH), and the characteristics of removing post-etch residues in the copper wiring process were analyzed. In the cleaning solution containing an amine group, the length of the component substituted with nitrogen and the length of the carbon chain influenced the cleaning effect, and the etching rate of copper oxide increased as the pH of the cleaning solution increased. The activity of the amine group is in the basic region, and the activity of the carboxyl group is in the acidic region, and the cleaning process proceeds through complex formation with copper or copper oxide in each region.

목적: 본 연구에서는 계면활성성분 및 함유량이 다른 콘택트렌즈 관리용액의 세척효율 및 가시광선투과율에 미치는 영향을 알아보고자 하였다. 방법: 다른 재질의 소프트렌즈(etafilcon A 및 hilafilcon B 재질)에 인공누액을 이용하여 각각 단백질을 침착시킨 후 계면활성성분 및 함유량이 다른 6종류의 다목적용액을 사용하여 세척한 후 그에 따른 세척효율 및 광투과율을 비교하였다. 결과: Etafilcon A 재질 렌즈의 경우 다목적용액으로 문지르기를 하여 세척하였을 때 세척효율은 다목적용액의 계면활성성분 농도와 표면장력에 따라 약 23~43%로 다양하게 나타났으며, 계면활성성분 이외에 과산화수소를 함유하는 다목적용액으로 세척 시 가장 높은 세척효율을 보였으나 렌즈에 잔존하는 단백질량이 많았다. 다목적용액으로 세척 후 가시광선투과율은 89.8%~90.8%으로 나타났다. Hilafilcon B 재질 렌즈에서는 인공누액에 7일간 배양하더라도 침착되는 단백질양이 매우 적어 etafilcon A 재질 렌즈의 5~10% 수준의 단백질량을 보였으며 가시광선투과율 감소도 크지 않았다. 다목적용액으로 문질러 세척하였을 경우 45.4~67.4%의 세척효율을 보였으나 etafilcon A 재질 렌즈와는 다른 세척효율 순서를 보였으며, 광투과율은 새 렌즈 수준으로 회복되었다. 결론: 이상의 결과로 소프트렌즈의 단백질 침전물의 올바른 관리를 위하여서는 다목적용액의 계면활성성분이나 원리에 대한 이해를 바탕으로 렌즈 재질과 침착된 단백질량에 따라 적절한 다목적용액을 선택하여야 하며, 제조사의 가이드라인과 상관없이 문지르기를 하여 관리하는 것이 보다 효율적임을 알 수 있었다.

Purpose: The present study was aimed to investigate the cleaning efficacy of multi-purpose solutions containing different types and content of surfactants and their effect on the visible light transmittance of soft lens. Methods: Soft lenses made of different materials (etafilcon A and hilafilcon B) were deposited tear proteins by using the artificial tear and then compared the resulting cleaning efficacy and visible light transmittance after cleaning the lens with 6 types of multi-purpose solutions containing different content of surfactants. Results: The cleaning efficacy of multi-purpose solutions was variously shown as approximately 23~43% according to the active concentration of surfactants and surface tension in multi-purpose solution when etafilcon A lens cleaned with rubbing. The highest cleaning efficacy was detected when cleaned with the multi-purpose solution containing hydrogen peroxide besides surfactant however, the amount of remaining protein was still high on the lens. After washed with multi-purpose solution, the visible light transmittance of lens was in 89.8 to 90.8%. The amount of protein deposited on hilafilcon B lens was very small compared with it on etafilcon A lens even though it was incubated in artificial tears for 7 days, which showed 5~10% of protein amount in etafilcon A lens and the decrease of visible light transmittance was also not significant. In case of rubbing with multi-purpose solution, the cleaning efficacy on hilafilcon B lens was in 45.4 to 67.4% however, the order of cleaning efficacy of multi-purpose solution was different from it on etafilcon A lens. The visible light transmittance of hilafilcon B lens has been restored to the level of new lens. Conclusions: From the result, it is concluded that the appropriate multi-purpose solution should be selected according to the lens material and the amount of protein deposit on the basis of understanding surfactants and active principle for proper care of protein deposit on soft lens and the cleaning with rubbing is more efficient for lens care regardless of manufacturer's guideline.

The process optimization of ozone concentration and half life time was investigated in ultra pure water and alkaline solutions for the wet cleaning of silicon wafer surface at room temperature. In the ultra pure water,. the maximum concentration (35 ppm) of ozone was measured at oxygen flow rate of 3 liters/min and ozone generator power over 60%. The half life time of ozone increased at lower power of ozone generator. Additive gases such as $N_2$ and $CO_2$ were added to increase the concentration and half life time of ozone. Although the maximum ozone concentration was higher with the addition of $N_2$ gas, a longer half life time was observed with the addition of $CO_2$. When $NH_4OH$ of 0.05 or 0.10 vol% was added in DI water, the pH of the solution was around 10. The addition of ozone resulted in the half life time less than 1 min. In order to maintain high pH and ozone concentration, ozone was continuously supplied in 0.05 vol% ammonia solutions. 3 ppm of ozone was dissolved in ammonia solutions. The static contact angle of silicon wafer surface became hydrophilic. The particle removal was possible alkaline ozone solutions. The organic contamination can be removed by ozonated ultra pure water and then alkaline solution containing ozone can remove the particles on silicon surface at room temperature.

In this paper, we address a new complete coverage navigation algorithm and guidance methodology for the cleaning robot. The proposed algorithm is based on the grid map. Six templates, excluding a Back-Trace(BT) template are used as the local navigation method. The effectiveness of the algorithm proposed in this paper is thoroughly demonstrated through simulations and the evaluation of parameters for the path execution.

The transport and deposition of corrosion products in pressurized water nuclear reactor (PWR) steam generators have led to corrosion (SCC, denting etc.) problems. Lancing, mechanical cleaning and chemical cleaning have been used to reduce these problems. The methods of lancing and mechanical cleaning have limitations in removing corrosion products due to the structure of steam generator tubes. But high temperature chemical cleaning (HTCC) with EDTA is the most effective method to remove corrosion products regardless of the structure. However, EDTA in chemical cleaning aqueous solution and chemical cleaning environments affects the integrity of materials used in steam generators. The nuclear power plants have to perform the pre-test (also called as qualification test (QT)) that confirms the effect on the integrity of materials after HTCC. This is one of the series studies that assess the effect, and this study determines the effects of 20 % EDTA aqueous solution on defective tubes in high temperature chemical cleaning environments. The depth and magnitude of defects in steam generator (SG) tubes were measured by eddy current test (ECT) signals. Surface analysis and magnitude of defects were performed by using SEM/EDS. Corrosion rate was assessed by weight loss of specimens. The ECT signals (potential and depth %) of defective tubes increased marginally. But the lengths of defects, oxides on the surface and weights of specimens did not change. The average corrosion rate of standard corrosion specimens was negligible. But the surfaces on specimens showed traces of etching. The depth of etching showed a range on the nanometer. After comprehensive evaluation of all the results, it is concluded that 20 % EDTA aqueous solution in high temperature chemical cleaning environments does not have a negative effect on defective tubes.

본 연구에서는 순수와 유사한 밀도의 세척형 구형 입자를 제작하고 순수 수조 내에서 산기량 및 입자 농도에 따른 입자의 유동 속도를 측정하였다. 세척형 구형 입자 1~3%를 MLSS 8,000 mg/L인 활성슬러지 용액에 주입하고 20 LMH 및 산기량 500 mL/min 조건에서 FR 및 SFCO 모드로 동시에 투과 실험하였다. 사용한 분리막은 유효 막면적이 $90cm^2$, 공칭 세공크기가 $0.4{\mu}m$인 평막이다. 입자 농도가 증가할수록 TMP가 감소하였으며 FR 모드, 입자 농도 2%일 때 가장 효과적인 것으로 확인되었다.

In this study the cleaning spherical beads with same density as water were fabricated. Bead moving velocity was measured with respect to the aeration rate and bead concentration in water reservoir. The permeation experiments for FR (filtration and relaxation) and SFCO (sinusoidal filtration continuous operation) modes were simultaneously carried out under the condition of 1 to 3% cleaning spherical bead concentration, 20 LMH and 500 mL/min aeration rate in the MLSS 8,000 mg/L activated sludge solution. The used membrane was the $90cm^2$ effective area and $0.4{\mu}m$ nominal pore size flat membrane. The TMP (transmembrane pressure) decreased as the bead concentration increased, and was shown most effective in FR mode with 2% bead concentration.