Earticle

Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.

최근 개발되는 임베디드 시스템의 경우 하드웨어와 소프트웨어의 구조가 매우 복잡해짐에 따라, 시스템에 탑재되는 소프트웨어의 신뢰성 확보를 위한 테스트 절차가 요구되고 있다. 특히 시스템에 탑재되는 소프트웨어는 다중 함수에 의해 의사결정이 되면서. 시스템 디자인 단계에서 요구되는 스펙(Specification)을 만족하지 못하는 경우가 빈번하게 발생한다 본 논문에서는 임베디드 소프트웨어의 자동화된 테스트를 위해 요구되는 검증 모듈을 디자인하고 구현하였다 검증 모듈은 요구사항 기반으로 설계되었으며, 각각의 요구사항을 만족하는 검증 모듈을 구현하여 실제 상용화 제품에 대한 테스트를 진행하였다.

최근 환경보호와 신재생에너지 확보 일환으로 태양광발전소가 널리 보급되고 있으며, 태양광 모듈의 효율적인 관리를 위해서는 정기적인 점검이 필요하다. 본 연구에서는 UAV 기반 열적외선 카메라와 GIS 공간분석을 통해 태양광 모듈에 대한 고장여부를 진단할 수 있는 실험을 실시하였다. 먼저 고정익 UAV와 RGB 카메라를 이용하여 영상을 촬영한 후 Pix4D SW를 통해 정사영상을 생성하였으며, 정사영상 자료를 이용하여 태양광 모듈 레이어를 구축한 후 코드를 입력하였다. 또한 태양광 모듈 고장여부를 진단하기 위해 고무덮개를 태양광 모듈에 설치하였으며, 열적외선 카메라로부터 얻어진 온도 정보와 태양광 모듈 레이어를 기반으로 Zonalmean 함수를 통해 태양광 모듈별 평균온도를 계산할 수 있었다. 마지막으로 GIS 공간분석을 통해 이상 발열이 확인된 $37^{\circ}C$ 이상의 모듈을 자동으로 추출하고 각 모듈별 고유식별 코드를 식별함으로써 고무 덮개를 설치한 모듈의 위치를 정확하게 분석할 수 있었다.

Recently, solar power plants have spread widely as part of the transition to greater environmental protection and renewable energy. Therefore, regular solar plant inspection is necessary to efficiently manage solar-light modules. This study implemented a test that can detect solar-light module faults using an UAV based thermal infrared camera and GIS spatial analysis. First, images were taken using fixed UAV and an RGB camera, then orthomosaic images were created using Pix4D SW. We constructed solar-light module layers from the orthomosaic images and inputted the module layer code. Rubber covers were installed in the solar-light module to detect solar-light module faults. The mean temperature of each solar-light module can be calculated using the Zonalmean function based on temperature information from the UAV thermal camera and solar-light module layer. Finally, locations of solar-light modules of more than $37^{\circ}C$ and those with rubber covers can be extracted automatically using GIS spatial analysis and analyzed specifically using the solar-light module's identifying code.

Researches about micro technology travel lively in these days. Such many researches are concentrated in the field of materials and a process field. But properties of micro materials should be known to give results of research developed into still more. In these various material properties, reliability data such as mechanical, optical, thermal property, etc is the basic property. In this paper, it is measured that is material properties of main BLU(Back Light Unit) components in LCD(Liquid Crystal Display). The pattern shape of prism sheet, diffuser film and reflective plate are measured by variable 3D scanning equipments. It is researched which is the method to measure an optimal 3D pattern shape in each components.

In this paper, we examined 10 domestic samples of three different model using thermal, humidity freeze, thermal-endurance and damp heat test under IEC61215 photovoltaic module environmental endurance test condition. Three was almost no changes on power generation. Insulation resistance capacity was much higher than judgement standard but, showed unstable results depending on environmental test items. On external appearance test, there were two models which showed bubble, humidity penetration, seal melted frame phenomenon. From this results, the degree of aging under the external environment is a main cause that shortens photovoltaic module life time. So it is considered that the efforts for finding optimum condition of manufacturing process should be needed.

According as diesel automobile are produced, reduce noise and vibration that is occurred by characteristic of diesel engine, and need engine room layout optimization and research for light weight of parts. Balance Shaft Module is module parts for vehicles engine to improve performance and efficiency of engine and reduce noise and vibration. These days, an oil pump integrated balance shaft module and an oil sump integrated balance shaft module is on the rising for optimizing of engine room. In this study, produced prototype of oil pump integrated type balance shaft module, and achieved dynamic characteristic test about experimental modal analysis and noise/vibration of balance shaft module.

The method of supplying a single voltage source to a drive has a weak point that we can not determine whether discharging cells of a upper panel in a PDP(Plasma display panel) operate properly or not in the step of testing a durable voltage. From this paper, we can make more reliable products by the design-method of a power-module, for testing a durable voltage, that can determine if discharging cells in a upper pannel in a PDP have something wrong in variously supplied voltage sources.

전 세계적으로 해운물류 안전 보안체계가 강화됨에 따라 국가물류보안 체계 구축을 위한 해운물류안전 보안 핵심기술 개발이 이루어지고 있다. 또한 미국에서 2018년 시행예정인 컨테이너 사전 100% 전수검사에 대응하기 위한 컨테이너 검색기의 핵심구성 요소인 Array 검출 시스템의 국산화 개발이 필요하다. 본 논문에서는 현재 자체 개발한 Test Digital 신호처리 Board를 가지고 TI-RTOS(Texas Instruments - Real Time Operating System)를 이용하여 개발한 Test Software Program을 제안한다. M4 MCU를 기반으로 GPIO, SRAM, TCP/IP와 SDcard등을 테스트 할 수 있는 프로그램을 개발했다. 또한 Array 검출 system 중 자체 개발한 Digital Signal Processing Board에 대한 연구를 제안하고자 한다. M4 MCU를 테스트 할 수 있는 테스트보드를 개발했고 FPGA와 MCU가 결합된 통한 X-RAY 디지털 신호처리 보드를 개발했다.

Shipping and logistics safety, security system is strengthening worldwide, the development of shipping and logistics safety security core technology for national security logistics system construction has been carried out. In addition, it is necessary to localize the Array Detection System, which is a core component of the container search machine, to cope with the 100% pre-inspection of the container scheduled for 2018 in the United States. In this research, we propose a test software program developed by using TI-RTOS (Texas Instruments - Real Time Operating System) with a test digital signal processing board which is developed self development. We have developed a program that can test GPIO, SRAM, TCP/IP, and SDcard using M4 MCU. Also we propose a study on a self-developed Digital Signal Processing Board among the array detection systems that replace foreign products. We have developed a test board that can test M4 MCU and developed an X-Ray Detector Digital Signal Processing Board that combines MCU and FPGA.

Isopropyl alcohol (IPA)/물의 투과증발 분리특성을 알아보기 위해 상용화된 Polyetherimide (PEI) 중공사막에 Poly(dimethyl siloxane) (PDMS)로 코팅한 복합막 모듈을 이용하여 파일롯 테스트를 실시하였다. 공급액으로는 물과 IPA를 각각 85 : 15로 혼합하여 사용하였다. 실험 결과로 $25^{\circ}C$에서 투과도 $0.52kg/m^2h$, IPA 농도 68.5%로 높은 수치를, $55^{\circ}C$에서 투과도 $1.368kg/m^2h$, IPA 농도 61.2%로 높은 투과도를 얻을 수 있었다. 테스트를 진행한 복합막 모듈의 내구성을 알아보기 위하여 약 100일간 반응온도를 $50^{\circ}C$로 설정하여 장기테스트를 진행하였고 그 결과 약 $1.03{\sim}1.15kg/m^2h$의 투과도와 61.8~62.5%의 IPA 농도로 초기 측정량과 큰 차이가 없음을 나타내었다.

To determine the pervaporation separation characteristics of IPA/water mixtures, PEI/PDMS hollow fiber membrane module commercialized by Airrane Co. was subjected to both lab and pilot tests. The flux of $0.52kg/m^2h$ and IPA concentration of 68.5% at $25^{\circ}C$ were obtained whereas the $1.368kg/m^2h$ and 61.2% were measured at $55^{\circ}C$. In order to realized the durability of the module, the long-term test (at $50^{\circ}C$) of 100 days has been conducted and as a result, the flux $1.03{\sim}1.15kg/m^2h$ and IPA concentration 61.8~62.5% were maintained with the initial values.

In this paper. we analyze electrical characteristics of photovoltaic module according to mechanical load test. Using the equipment for giving load on the surface of module, dark current-voltage is measured. By varying load from 0kg to 206kg, slight different I-V curve is detected. From this, reduced shunt resistance is roughly calculated and micro crack is assumed to be happened. system Through this experiment, periodic external force on PV module might give an negative effect. The detailed analysis is described in the following paper.

The device for a life test of a railway vehicle headlight LED was produced and design. The manufactured life test apparatus has a structure in which the illuminance of a plurality of samples is measured by a single illuminance measuring apparatus. In order to measure the illuminance of the life test apparatus, all the samples were turned off, and then the individual power was supplied sequentially to select the measurement method. However, this illumination measurement method has a phenomenon in which the measured illuminance differs from the normal illuminance when the sample is turned off and then supplied again. In this paper, we investigate the cause of the difference in illuminance and studied the illuminance measurement method to solve it.

The wider band gap, higher thermal conductivity and larger critical electric field allow SiC devices to operate at higher temperatures, higher current density and higher blocking voltages than Si power devices. Therefore, the SiC base power module for electric vehicle can operate well over 400℃. The mechanical strength of ultrasonic bonded Cu terminal and AMB (Active metal brazing) substrate was evaluated with various bonding load and bonding times. AMB substrate consisted of 300 ㎛ copper layer and 320 ㎛ Si3N4 substrate in thickness, respectively. Also bonding strength of the Cu terminal and AMB substrate was investigated with high temperature storage (HTS) test and thermal shock (TS) test. The shear test was conducted with 200 ㎛ of shear height and 200 ㎛/s of shear speed. The cross-sectional micrographs in Cu terminal and AMB substrate consisted of unbonded zone and bonded zone. As a whole, fracture was induced at the interface between Cu terminal and AMB substrate. The highest shear strength was 41.5 MPa at 50 kgf of bonding load for 1.25 s in bonding time.

비탈면의 유실, 붕락사고 등 비탈면에 대한 안정성을 파악하기 위해서 지층의 구성상태, 역학적 특성 등의 지반정보 파악이 필요하다. 이러한 지반정보를 파악하기 위해서 일반적으로 표준관입시험(SPT) 및 콘 관입시험 등이 널리 이용되고 있다. 대부분이 급경사로 이루어지고 진입로가 없는 비탈면에 대한 접근성 문제로 표준관입시험이 널리 활용되지 못하고 있다. 이러한 단점을 보완할 수 있는 있는 휴대용 장비인 Drop Cone Penetrometer(DCP)를 이용한 조사도 여러 가지 문제로 제한적으로 사용되고 있다. 따라서 본 연구에서는 비탈면 현장접근이 용이한 휴대용 시추기와 동적콘관입시험 모듈을 개발하고, 개발된 동적콘관입시험기를 이용한 결과와 동일 현장에서 수행한 표준관입시험값과 상관성을 분석하였다. 에너지전단율로 보정된 동적콘관입시험과 표준관입시험간의 상관식은 N_d' = 3.13 N'으로 나타났다.

To assess the stability of a slope and the likelihood of its loss or collapse requires information about the ground, such as the composition of the stratum and its mechanical characteristics. This information is generally gathered through standard penetration testing (SPT) and cone penetration testing. SPT is not widely used due to problems with accessing slopes, most of which are steep and without ramps. A drop cone penetrometer, a portable device that can make up for these shortcomings, can be used in a limited way in some circumstances. Therefore, we developed a portable drilling machine and a small dynamic cone penetration test module that can easily access a slope site and perform SPT. The correlation of the developed system's results with those from SPT was analyzed. Analysis of the correlation between the energy shear rate passing to the load during the different test types established that the energy shear rate is reflected in the test result. The correlation between corrected dynamic cone penetration testing and corrected SPT was N_d' = 3.13 N'.

Underwater explosion shock response analysis of a nonlinear double resiliently mounted equipment on a MIL-S-901D Large Floating Shock Platform(LFSP) was carried out using LS-DYNA3D/USA. As a nonlinear double resiliently mounted equipment, real main engine module of naval ship was considered, where the engine, bearing, and base frame including sound enclosure were treated as rigid bodies with six degrees of freedom. The nonlinear effects of resilient mounts on its shock response characteristics were examined, and the usefulness of our suggested method was also confirmed comparing with calculation results by the equipment maker.