Earticle

초록

영어

Printed piezoelectric sensor labels can convert package deformation into electrical signals, but their response depends strongly on where the label is attached to the package surface. In this study, a static-equivalent top-impact placement- screening method was constructed for printed PVDF/carbon nitride nanotube (CNNT) piezoelectric sensor labels on a corrugated transport package. A 200 mm × 120 mm × 100 mm package model was used, and four label regions were compared: central-edge, adjacent, side, and impact-reference positions, using the domain-averaged von Mises stress. The directly impacted label served only as a normalization reference, and results were reported as stress-transfer factors and reference-normalized voltage-equivalent indices rather than measured dynamic voltages. At 40 N, the central-edge, adjacent, and side positions reached stress-transfer factors of 0.6953, 0.6034, and 0.2434, respectively. These factors identify the central-edge region as the most suitable off-impact placement. The framework provides a reproducible way to screen sensor-label positions before dynamic drop testing and full package validation.

목차

Abstract
Introduction
Materials and Methods
1. Sensor-material basis and calibration separation
2. Package geometry and sensor-position design
3. Static-equivalent structural model and mesh
4. Domain-averaged stress and voltage-equivalent index
Results and Discussion
1. Placement concept and Fig. 1
2. Load-dependent domain-averaged stress response
3. Reference-normalized response at 40 N
4. Sensor-placement implications for transport packaging
5. Scope and limits of the static-equivalent index
Conclusions
Acknowledgements
References

키워드

저자

• Omkar Y. Pawar [ Graduate School of Flexible and Printable Electronics, LANL-JBNU Engineering Institute-Korea, Jeonbuk National University ]
• Siyoung Yang [ Department of Mineral Resources and Energy Engineering, Research Institute of Energy and Mineral Resources Development, Jeonbuk National University ] Corresponding Author
• Sooman Lim [ Graduate School of Flexible and Printable Electronics, LANL-JBNU Engineering Institute-Korea, Jeonbuk National University ] Corresponding Author

참고문헌

발행기관

간행물

표지보기 관심저널 등록

• 간행물명

  한국포장학회지 [Journal of Korea Society of Packaging Science & Technology]

• 간기

  연3회

• pISSN

  1226-0207

• 수록기간

  1994~2026

• 등재여부

  KCI 등재

• 십진분류

  KDC 530 DDC 620