The use of thin-film materials with micro- or nano-scale thickness has been increasingly adopted in the semiconductor materials field. Sputtering, a physical vapor deposition (PVD) technique, is widely utilized in various industrial applications as it employs plasma under vacuum conditions to transfer target materials onto substrate surfaces, thereby forming thin-film coatings. Owing to their significantly reduced thickness compared to bulk materials, thin films often exhibit mechanical properties that differ markedly from those of conventional materials. Consequently, an accurate evaluation of thin-film mechanical properties requires a thorough understanding of the substrate on which the films are deposited. In this study, aluminum (Al) thin films with thicknesses of up to 1000nm were deposited onto silicon wafer (Si-wafer) substrates using a sputtering system. The mechanical properties of the deposited thin films were evaluated through micro-Vickers hardness testing under various applied load conditions.