A Gate-All-Around (GAA) structure for 3D DRAM was fabricated using an ALD-based oxide semiconductor channel to enable low-temperature processing and suppress leakage current. Spacer engineering with ALD and dry-oxidized SiO2 effectively reduced leakage paths compared to PECVD. The use of Al2O3 as the gate insulator further improved insulation. The device demonstrated promising performance with Ion = 1.30 μA and SS = 113 mV/decade at VDS = 1.1 V, indicating its potential for next-generation memory applications.
목차
Abstract I. Introduction 2. Experimental Procedure 3. Results and Discussion 4. Conclusion References
저자
Seong Hun Yoon [ Department of Display Science and Engineering, Hanyang University ]
Jae Kyeong Jeong [ Department of Display Science and Engineering, Hanyang University ]