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Design of a small punch test apparatus for cryogenic environments using conduction cooling

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  • 발행기관
    한국초전도저온학회 (구 한국초전도저온공학회) 바로가기
  • 간행물
    한국초전도·저온논문지 (구 한국초전도저온공학회논문지) KCI 등재 SCOPUS 바로가기
  • 통권
    Vol.26 No.4 (2024.12)바로가기
  • 페이지
    pp.83-88
  • 저자
    Seungcheol Ryu, Yubin Kim, Seunggun Lee, Seokho Kim
  • 언어
    영어(ENG)
  • URL
    https://www.earticle.net/Article/A463049

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초록

영어
This study aims to design a Small Punch Test (SPT) apparatus for cryogenic environments using conduction cooling. SPT is a non-destructive testing method developed to evaluate material softening and embrittlement in applications such as power plants and fusion reactors. Compared to conventional tensile testing, SPT offers economic advantages in terms of miniaturization and repeatability. However, existing cryogenic SPT rely on liquid helium or evaporated helium gas, which involve high costs and inefficiency. In this study, a cryogenic cooling system utilizing a cryocooler was developed to eliminate the use of liquid helium, along with a rotary sample holder designed to enable testing of multiple specimens in a single cooling cycle. Key design considerations included minimizing external heat intrusion, optimizing thermal management of the load application structure, designing flexible copper connectors suitable for rotation, and applying multilayer insulation (MLI) to reduce radiative heat loads. In particular, the conduction cooling path was optimized to ensure that the specimen temperature could be stably maintained below 20 K, while minimizing displacement in the load application structure and enhancing thermal stability tailored to the characteristics of SPT. The proposed testing apparatus significantly improves cost efficiency and testing productivity compared to existing systems, and it is expected to set a new standard for material property evaluation in cryogenic environments.

목차

Abstract
1. INTRODUCTION
2. EXPERIMENTAL APPARATUS DESIGN
2.1. Design and Structure of Small Punch Tester with Conduction Cooling
2.2. Internal Structure of the Test Cryostat
2.3. Thermal Design of the Tester Cryostat
3. THERMAL ANALYSIS OF SPT UTILIZING CONDUCTION COOLING METHOD
3.1. Temperature Distribution and Thermal Load Optimization Results
3.2. Variable Temperature Control for Specimen Testing
4. CONCLUSION
ACKNOWLEDGMENT
REFERENCES

키워드

conduction cooling cryogenic material property evaluation small punch test (SPT)

저자

  • Seungcheol Ryu [ Smart Manufacturing Engineering, Changwon National University, Republic of Korea ]
  • Yubin Kim [ Smart Manufacturing Engineering, Changwon National University, Republic of Korea ]
  • Seunggun Lee [ Department of Hydrogen Materials Evaluation, Extreme Materials Institute Korea Institute of Materials Science, Republic of Korea ]
  • Seokho Kim [ Mechanical Engineering, Changwon National University, Republic of Korea ] Corresponding Author

참고문헌

자료제공 : 네이버학술정보

간행물 정보

발행기관

  • 발행기관명
    한국초전도저온학회 (구 한국초전도저온공학회) [The Korean Society of Superconductivity and Cryogenics (KSSC)]
  • 설립연도
    1998
  • 분야
    공학>전기공학
  • 소개
    21세기 핵심기술인 초전도공학과 저온공학분야의 기술 수준을 향상시키고, 선진 외국의 관련 학회와의 국제 교류 뿐만 아니라 이 분야에서 산.학.연의 학술활동 및 기술교류의 구심점으로의 그 역할을 성실히 수행하고자 한다.

간행물

  • 간행물명
    한국초전도·저온논문지 (구 한국초전도저온공학회논문지) [Progress in Superconductivity and Cryogenics]
  • 간기
    계간
  • pISSN
    1229-3008
  • eISSN
    2287-6251
  • 수록기간
    1999~2026
  • 등재여부
    KCI 등재,SCOPUS
  • 십진분류
    KDC 427 DDC 537

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