Gwantae Kim, Insung Park, Jeongtae Kim, Hosup Kim, Jaehun Lee, Hongsoo Ha
언어
한국어(KOR)
URL
https://www.earticle.net/Article/A440932
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4,000원
원문정보
초록
영어
Until now, many research activities have been conducted to commercialize high-temperature superconducting (HTS) wires for electric applications. Most of all researchers have focused on enhancing the piece length, critical current density, mechanical strength, and throughput of HTS wires. Recently, HTS magnet for generating high magnetic field shows degraded performance due to the deformation of HTS wire by high electro-magnetic force. The deformation can be derived from widthwise thickness non-uniformity of HTS wire mainly caused by wet processes such as electropolishing of metal substrate and electro-plating of copper. Gradient sputtering process is designed to improve the thickness uniformity of HTS wire along the width direction. Copper stabilizing layer is deposited on HTS wire covered with specially designed mask. In order to evaluate the thickness uniformity of HTS wire after gradient sputtering process, the thickness distribution across the width is measured by using the optical microscope. The results show that the gradient deposition process is an effective method for improving the thickness uniformity of HTS wire.
목차
Abstract 1. INTRODUCTION 2. EXPERIMENTAL 2.1. 고온초전도선재 단면분석 3. RESULT AND DISCUSSION 4. CONCLUSION ACKNOWLEDGMENT REFERENCES