함정탑재용 고발열 전자장비의 열적안정성 확보를 위한 수치적, 실험적 연구
Numerical Analysis and Experimental Study to Required Thermal Stability of High Heat Electronic Equipment for Shipboard Application
In this study, we performed thermal safety design of the electric module of a heat-loaded equipment with consideration of its heat dissipation performance. Initially, we calculated the heat dissipation of natural convection to choose a cooling method. Based on this, we found that some modules required forced convection and selected an air-cooling method with an outdoor temperature of 43 degrees Celsius, which is the maximum temperature in Korea. Prior to module production, we performed thermal analysis of each module and proceeded with a design to increase the thermal conductivity of the module as a primary step, and subsequently proceeded with Heat Sink design to maximize the heat dissipation performance. After considering various constraints according to the system requirements and designing the cooling path, we experimentally and analytically secured thermal safety at the operating temperature of the equipment.
목차
ABSTRACT 1. 서론 2. 본론 2.1 냉각 방식 선정 2.2 냉각 Path 설계 2.3 시스템 수치 해석적 접근 2.4 시스템 온도 시험 3. 결론 후기 References
키워드
냉각성능실험적연구Cooling performanceExperimental method.
저자
이재훈 [ Jae-Hoon Lee | Mechanical Engineering R&D Lab, LIG Nex1 Co., Ltd. ]
Corresponding Author