Earticle

초록

영어

Applications of REBa2Cu3O7-δ tapes require joints with a simple manufacturing process, low resistance and good mechanical properties. In the present study, we successfully developed a copper diffusion joint between Cu-stabilized REBa2Cu3O7-δ tapes that meets the above requirements without solder simply by applying flux, heat and pressurization. After a 3 min thermocompression process at approximately 150 ℃ and 336 MPa in air, two tapes were directly connected between Cu stabilizers by copper diffusion, which was proven by microstructure analysis. The specific resistivity of the copper diffusion joint reached 5.8 nΩ·cm2 (resistance of 0.4 nΩ for a 306 mm splicing length) at 77 K in the self-field. The axial tensile stress reached 200 N without critical current degradation. The results show promise for the preparation of copper diffusion joints to be used in coils, attached tapes, and wire/cable terminals.

목차

Abstract
1. INTRODUCTION
2. MATERIALS AND METHODS
2.1. REBCO tapes
2.2. Thermocompression equipment and procedures
2.3. Test measurement
3. RESULTS AND DISCUSSIONS
3.1. Microstructure of the copper diffusion joints
3.2. Keys to successful bonding
3.3. Electrical and mechanical characteristics
3.4. Comparison of three resistive joints of REBCO tapes
4. CONCLUSIONS
ACKNOWLEDGE
REFERENCES

키워드

저자

• Wei Ren, Zhen Huang [ Shanghai Jiao Tong University, Shanghai, China ] Corresponding author
• Fangliang Dong [ Shanghai Jiao Tong University, Shanghai, China ]
• Yue Wu [ Shanghai Jiao Tong University, Shanghai, China ]
• Zhijian Jin [ Shanghai Jiao Tong University, Shanghai, China ]

참고문헌

발행기관

간행물

표지보기 관심저널 등록

• 간행물명

  한국초전도·저온논문지 (구 한국초전도저온공학회논문지) [Progress in Superconductivity and Cryogenics]

• 간기

  계간

• pISSN

  1229-3008

• eISSN

  2287-6251

• 수록기간

  1999~2026

• 등재여부

  KCI 등재,SCOPUS

• 십진분류

  KDC 427 DDC 537