Earticle

초록

영어

Thin-film shape technology is recognized for its core technology to enhance the technology of LCD, PDP, semiconductor manufacturing processes, hard disks and optical disks, and is widely used to form coated thin films of products. In addition, resistance(electron beam filament) technology for heating is used to manufacture filament for ion implants used in semiconductor manufacturing processes. By establishing an electronic beam filament production system and developing seven specifications of electronic beam filament, it is contributing to improving trade dynamics and increasing exports to Japan through localized media of theoretical imports to domestic companies. In this study, CAE analysis was performed after setting electron beam filament specification and development objectives, facilities and fabrication for electron beam filament production, electron beam filament JIG & fixture design and fabrication followed by electron beam filament prototype. Then, the automation and complete inspection equipment of the previously developed electronic beam filament manufacturing facilities was developed and researched to mass-produce them, to analyze and modify prototypes, design and manufacture automation facilities, and finally, to design and manufacture the complete inspection equipment. In this paper, mainly electron beam filament specification analysis and development objectives and CAE analysis were dealted with.

목차

ABSTRACT
1. 서론
2. 기술수준 및 전자빔 필라멘트의 구조
2.1 현재의 국내외 기술수준
2.2 전자빔 필라멘트의 구조
3. 전자빔 필라멘트 세부사양 분석, 목표설정 및 CAE 해석
3.1 전자빔 필라멘트 세부사양 분석, 개발목표 설정
3.2 CAE 해석
4. 결론
References

키워드

저항체 전열용 전자빔 필라멘트 해석 분석 CAE Resistor Heating Electron beam filament Analysis Computer Aided Engineering

저자

• 이정익 [ Jeong-Ick Lee | INHA Techncal College, Dept. of Mechanical Design ] Corresponding Author

참고문헌

발행기관

간행물