Modeling the Effects of Electrical and Non-Electrical Parameters on the Material Removal and Surface Integrity in Case of μEDM of a Non-Conductive Ceramic Material using a Combined Fuzzy-AOM Approach
Micro-EDM is a non-contact process based on the thermoelectric energy between a tool electrode and a workpiece. In μEDM process, the mechanism of material removal is melting and evaporation. The thermal energy in the discharge plasma helps remove material from the workpiece, at the same time deteriorates the quality and integrity of the workpiece surface. The material removal phenomenon in μEDM of partially conductive and non-conductive materials is very complex. This paper presents a novel approach to model the effects of electrical and non-electrical parameters on the material removal phenomenon and surface integrity for a non-conductive ceramic material. The fuzzy logic modeling system is employed for predicting the μEDM process responses. The trends in the material removal rate and hardness values with the chosen electrical and non-electrical parameter for the model and obtained using AOM approach are compared. The average deviation between the model predictions and the results obtained using AOM plots is less than 10%. The material removal rate (MRR) decreases linearly with voltage, indicating a difference in material removal mechanism in the μEDM of non-conductive materials.
목차
Abstract 1. Introduction 2. Electrical and Non-Electrical Parameters in μEDM 3. Analysis of Material Removal Rate (MRR) 4. Analysis of Surface Integrity 5. Conclusions References
키워드
MachiningμEDMMaterial removalSurface integrityProcess parameterAnalysis of means
저자
Govindan Puthumana [ Post-Doctoral Researcher (Technical University of Denmark, Lyngby) ]
보안공학연구지원센터(IJAST) [Science & Engineering Research Support Center, Republic of Korea(IJAST)]
설립연도
2006
분야
공학>컴퓨터학
소개
1. 보안공학에 대한 각종 조사 및 연구
2. 보안공학에 대한 응용기술 연구 및 발표
3. 보안공학에 관한 각종 학술 발표회 및 전시회 개최
4. 보안공학 기술의 상호 협조 및 정보교환
5. 보안공학에 관한 표준화 사업 및 규격의 제정
6. 보안공학에 관한 산학연 협동의 증진
7. 국제적 학술 교류 및 기술 협력
8. 보안공학에 관한 논문지 발간
9. 기타 본 회 목적 달성에 필요한 사업
간행물
간행물명
International Journal of Advanced Science and Technology
간기
월간
pISSN
2005-4238
수록기간
2008~2016
십진분류
KDC 505DDC 605
이 권호 내 다른 논문 / International Journal of Advanced Science and Technology Vol.95