In Wireless Sensor Networks (WSN), a key agreement scheme is an essential task for secure communications. Recently, Lee and Kim proposed a hierarchical key agreement scheme for the fresh key establishment in WSN. This scheme achieves a secure session key agreement. In this paper, we analyze the security of the scheme and illustrate that their scheme is unconfident against the insider attack in practice. Moreover, it is also difficult to resist the replay attack in this scheme. Then, we proposed a novel scheme inspired by their scheme. The entities of our scheme include a Sink besides the sensor nodes, which interrupts the construction of the insider attack. Our scheme adopts the timestamp mechanism to resist replay attack, which could decrease the storing requirement of the sensor nodes. Thus, it is more practical and realistic. We illustrate that our proposal can provide stronger security than Lee and Kim’s scheme.
목차
Abstract 1. Introduction 2. Preliminaries 2.1. Basic System Model 2.2. Mathematical Backgrounds 2.3. Notations 3. Review of the Scheme in Paper 3.1. Hierarchical Key Settlement Phase 3.2. Session Key Agreement and Secure Communication Phase 4. Cryptanalysis of Lee and Kim’s Scheme 4.1. Our Security Model 4.2. Weaknesses 5. Our Enhanced Scheme 5.1. System Parameter Generation Phase 5.2. Initial Phase 5.3. Authentication and Key Agreement Phase 6. Correctness and Security Analysis 6.1. Correctness 6.2. Security Analysis 6.3. Security Comparison 7. Conclusion Acknowledgements References
보안공학연구지원센터(IJMUE) [Science & Engineering Research Support Center, Republic of Korea(IJMUE)]
설립연도
2006
분야
공학>컴퓨터학
소개
1. 보안공학에 대한 각종 조사 및 연구
2. 보안공학에 대한 응용기술 연구 및 발표
3. 보안공학에 관한 각종 학술 발표회 및 전시회 개최
4. 보안공학 기술의 상호 협조 및 정보교환
5. 보안공학에 관한 표준화 사업 및 규격의 제정
6. 보안공학에 관한 산학연 협동의 증진
7. 국제적 학술 교류 및 기술 협력
8. 보안공학에 관한 논문지 발간
9. 기타 본 회 목적 달성에 필요한 사업
간행물
간행물명
International Journal of Multimedia and Ubiquitous Engineering
간기
월간
pISSN
1975-0080
수록기간
2008~2016
등재여부
SCOPUS
십진분류
KDC 505DDC 605
이 권호 내 다른 논문 / International Journal of Multimedia and Ubiquitous Engineering Vol.11 No.9