Earticle

목차

Abstract
 1. Introduction
 2. IGBT Failure Mechanism
  2.1. Failure Related to Chip 
  2.2. Failure Related to Packaging 
 3. Experiment Analysis of IGBT Accelerated Degradation 
 4. Degradation Feature Selection and Data Preprocessing of IGBT
 5. IGBT Health Prediction of Process Neural Network based on LM Optimization
  5.1. The Topology Structure of Process Neural Network
  5.2. Orthogonal basis Expansion of Process Neural Network Model
  5.3. LM Learning Algorithm Optimization Process based on the Orthogonal Basis Expansion
 6. IGBT Health State Parameter Prediction
 7. Conclusion
 References

키워드

저자

• Bing Chen [ College of Electronic Engineering, Naval University of Engineering, Wuhan, China ]
• Gang Lu [ Equipment Department of the Navy, Beijing, China ]
• Hongzhen Fang [ Beijing Aerospace Measure & Control Corp. Ltd, Beijing, China, Beijing Key Laboratory of High-speed Transport Intelligent Diagnostic and Health Management, Beijing, China ]
• Li Ai [ Beijing Aerospace Measure & Control Corp. Ltd, Beijing, China, Beijing Key Laboratory of High-speed Transport Intelligent Diagnostic and Health Management, Beijing, China ]
• Huanzhen Fan [ Beijing Aerospace Measure & Control Corp. Ltd, Beijing, China, Beijing Key Laboratory of High-speed Transport Intelligent Diagnostic and Health Management, Beijing, China ]

참고문헌

발행기관

간행물

표지보기 관심저널 등록

• 간행물명

  International Journal of Future Generation Communication and Networking

• 간기

  격월간

• pISSN

  2233-7857

• 수록기간

  2008~2016

• 십진분류

  KDC 505 DDC 605