This paper the regular patterns of chip flow, chip curler radius and thickness under different cutting parameters when processing PE WPC with different wood flour contents under the condition of up milling and down milling. Compared with up milling, down milling has greater impact on chip flow direction and cutting speed. However, there are more dust-shaped chips in the up milling. In the down milling, chip curler has less change with cutting parameters. Only when the feed speed is 14m/min or the cutting speed is 1800m/min, the chip curl radius is larger. The chip thickness increases when the feed speed or the cutting width increases and decreases when the cutting speed increases.
목차
Abstract 1. Introduction 2. Experimental Setup 2.1. Experimental Materials and Equipments 2.2. Experimental Strategy 3. Chip Deformation Zone 4. Chip Flow Experiment Result 4.1. The Influence of the Feed Speed on Chip Flow 4.2. The Influence of the Cutting Speed on Chip Flow 4.3. The Influence of the Cutting Width on cChip Flow 5. Chip Parameters Experiment Result 5.1. Chip Curler Radius 5.2. Chip Thickness 6. Conclusions Acknowledgments References
Shi Wenyong [ Forest Woodworking Machinery Research and Development Center, Northeast Forestry University, Harbin 150040, P R China, Division of Graduate, Harbin University of Science and Technology, Harbin 150080, P R China ]
Ma Yan [ Forest Woodworking Machinery Research and Development Center, Northeast Forestry University, Harbin 150040, P R China ]
Wu Zhe [ Forest Woodworking Machinery Research and Development Center, Northeast Forestry University, Harbin 150040, P R China ]
Yang Chunmei [ Forest Woodworking Machinery Research and Development Center, Northeast Forestry University, Harbin 150040, P R China ]
보안공학연구지원센터(IJUNESST) [Science & Engineering Research Support Center, Republic of Korea(IJUNESST)]
설립연도
2006
분야
공학>컴퓨터학
소개
1. 보안공학에 대한 각종 조사 및 연구
2. 보안공학에 대한 응용기술 연구 및 발표
3. 보안공학에 관한 각종 학술 발표회 및 전시회 개최
4. 보안공학 기술의 상호 협조 및 정보교환
5. 보안공학에 관한 표준화 사업 및 규격의 제정
6. 보안공학에 관한 산학연 협동의 증진
7. 국제적 학술 교류 및 기술 협력
8. 보안공학에 관한 논문지 발간
9. 기타 본 회 목적 달성에 필요한 사업
간행물
간행물명
International Journal of u- and e- Service, Science and Technology
간기
격월간
pISSN
2005-4246
수록기간
2008~2016
십진분류
KDC 505DDC 605
이 권호 내 다른 논문 / International Journal of u- and e- Service, Science and Technology Vol.9 No.7