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Poly[N-(formyloxyphenyl)maleimide] 고분자의 합성과 자외선에 대한 반응특성
Synthesis and Photosensitive Properties of Poly[N-(formyloxy phenyI)maleimide] Containing Photosensitive Groups

첫 페이지 보기
  • 발행기관
    한국포장학회 바로가기
  • 간행물
    한국포장학회지 바로가기
  • 통권
    Vol. 10 No. 1 (2004.06)바로가기
  • 페이지
    pp.55-62
  • 저자
    김상민
  • 언어
    한국어(KOR)
  • URL
    https://www.earticle.net/Article/A277158

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원문정보

초록

영어
Synthesis of poly[N-(formyloxyphenyl)maleimide](PFOMI) as photopolymer were investigated with various kinds of photosensitive groups. Generally, photopolyimide have some deficiencies in solubility, sensitivity, reserve stability of the photosensitive solution, and the precision of image pattern. The study has been required on those polymers which have high glass transition temperature and photo efficiency, and low dielectricity. The existing condensation resins require high curing temperature and perfect elimination of subreacted materials that are produced during the process after irradiation and various membrane damages such as the deformation and contraction in image pattern cure. In this study poly[N-(hydroxyphenyl)maleimide](PHPMI) was synthesized. The PHPMI were analyzed by H-NMR and FT-IR. The measured number average molecular weight of PHPMI was produced was 1.06 ×104. Poly[N-(formyloxyphenyl)maleimide](PFOMI) as a type of photo-Fries rearrangement was synthesized by NHPMI and formic acid followed by radical polymerization. PFOMI was analyzed by FT-IR, and photocharacteristics was investgated by UV spectra and FT-IR before and after UV irradiation. Based on the image characteristics of PFOMI measured from optical micrographs, it was formed that the resolution of positive type PFOMI was 0.5 um.

목차

Abstract
 서론
 실험
  N-(hydroxyphenyl) maleimide(NHPMI)의 합성
  Photo-Fries 전위형 polyimide(PFOMI)의 합성
 결과 및 고찰
  NHPMI의 특성
  PFOMI polymaleimide의 특성 
  PFOMI의 감광특성
 결론
 참고문헌

저자

  • 김상민 [ Sang Min Kim | 신성대학 화장품 신소재계열 ]

참고문헌

자료제공 : 네이버학술정보

간행물 정보

발행기관

  • 발행기관명
    한국포장학회 [Korea Society Of Packaging Science & Technology]
  • 설립연도
    1994
  • 분야
    공학>기타공학
  • 소개
    포장기술의 학문적인 발전을 도모하고 국내포장산업의 기술수준 제고를 위하여 선진포장기술 유입의 창구역할을 함

간행물

  • 간행물명
    한국포장학회지 [Journal of Korea Society of Packaging Science & Technology]
  • 간기
    연3회
  • pISSN
    1226-0207
  • 수록기간
    1994~2026
  • 등재여부
    KCI 등재
  • 십진분류
    KDC 530 DDC 620

이 권호 내 다른 논문 / 한국포장학회지 Vol. 10 No. 1

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