This study aims to investigate static fracture properties on adhesive layers by conducting simulation static analysis by thickness. Simulation analysis result showed that all specimens at t=35mm, 45mm, and 55mm showed maximum reaction force at approximately 5mm of forced displacement. Simulation analysis showed that maximum reaction forces of specimen models were approximately 0.25kN at t=35mm, approximately 0.28kN at t=45mm, and approximately 0.5kN at 55m, respectively. As such, the maximum reaction forces of specimen models that occur had increasing tendency along with increasing thickness. The study results showed fracture properties of aluminum foam adhesive specimen models at their adhesive layers. Based on accumulated data, it is thought that the data on variables other than variables in this study may be acquired easily, and that the data would contribute to analyzing mechanical properties of DCB adhesive structures with mode III-type.
목차
Abstract 1. Introduction 2. Research Method 2.1. Research Model 2.2. Boundary Condition for the Simulation Analysis 3. Simulation Analysis Results 3.1. Analysis Result of Specimen with t=35mm 3.2. Analysis Result of Specimen with T=45mm 3.3. Analysis Result of Specimen with T=55mm 3.4. Comparison of Analysis Results for Each Specimen 4. Conclusions References
Jung Ho Lee [ Department of Mechanical Engineering, Graduate School, Kongju National University, 1223-24, Cheonan Daero, Seobuk-gu, Cheonan-si, Chungnam of Korea ]
Jae Ung Cho [ Division of Mechanical & Automotive Engineering, Kongju National University, 1223-24, Cheonan Daero, Seobuk-gu, Cheonan-si, Chungnam of Korea ]
Corresponding Author
보안공학연구지원센터(IJMUE) [Science & Engineering Research Support Center, Republic of Korea(IJMUE)]
설립연도
2006
분야
공학>컴퓨터학
소개
1. 보안공학에 대한 각종 조사 및 연구
2. 보안공학에 대한 응용기술 연구 및 발표
3. 보안공학에 관한 각종 학술 발표회 및 전시회 개최
4. 보안공학 기술의 상호 협조 및 정보교환
5. 보안공학에 관한 표준화 사업 및 규격의 제정
6. 보안공학에 관한 산학연 협동의 증진
7. 국제적 학술 교류 및 기술 협력
8. 보안공학에 관한 논문지 발간
9. 기타 본 회 목적 달성에 필요한 사업
간행물
간행물명
International Journal of Multimedia and Ubiquitous Engineering
간기
월간
pISSN
1975-0080
수록기간
2008~2016
등재여부
SCOPUS
십진분류
KDC 505DDC 605
이 권호 내 다른 논문 / International Journal of Multimedia and Ubiquitous Engineering Vol.11 No.5