Earticle

초록

영어

The change cause of the thermal imager alignment and its detection principle are analyzed in this paper. On this basis, an infrared thermal imaging is designed for the shortcomings of the traditional detection method, that alignment change detection system is based on CCD imaging technology. The cross pinhole target is used to establish the measurement space coordinate system for the digital image interpretation program in this system. The interpretation software is called about aiming at the baseline variation in the data processing system. According to the position relationship of the 5 pin hole in the field of the infrared thermal imager, the alignment change can be measured. The experimental results show that the system can effectively test the change in the baseline of the thermal imager, and the uncertainty of the test is better than 0.05mil.

목차

Abstract
 1. Introduction
 2. Production of the Amount of Alignment Change
 3. Alignment Variation Detection Principle
 4. The Thermal Imager Alignment Variation Test System
  4.1. Traditional Thermal Imager Alignment Variation Test System
  4.2. Modern Thermal Imager Alignment Variation Test System
 5. The Measurement Results and Accuracy Analysis
 6. Conclusions
 Reference

키워드

저자

• Miao Cao [ Changchun University of Science and Technology, Jilin Changchun, 130022, China ]
• Wenjie Cui [ Changchun University of Science and Technology, Jilin Changchun, 130022, China ]

참고문헌

발행기관

간행물

표지보기 관심저널 등록

• 간행물명

  International Journal of Smart Home

• 간기

  격월간

• pISSN

  1975-4094

• 수록기간

  2008~2016

• 십진분류

  KDC 505 DDC 605