Earticle

초록

영어

This paper addresses technical problems of thermal contact conductance or resistance which inevitably occurs in most cryogenic engineering systems. The main focus of this paper is to examine what kind of physical factors primarily influences the thermal contact resistance and to suggest how it can be minimized. It is a good practical rule that the contact surface must have sub-micron roughness level with no oxide layer and be thinly covered by indium, gold, or Apiezon-N grease for securing sufficient direct contact area. The higher contact pressure, the lower the thermal contact resistance. The general description of this technique has been widely perceived and reasonable engineering results have been achieved in most applications. However, the detailed view of employing these techniques and their relative efficacies to reduce thermal contact resistances need to be thoroughly reviewed. We should consider specific thermal contact conditions, examine the engineering requirements, and execute each method with precautions to fulfil their maximum potentials.

목차

Abstract
 1. INTRODUCTION
 2. EXPERIMENTAL APPARATUSES
 3. RESULTS
 4. DISCUSSION
 5. SUMMARY
 ACKNOWLEDGEMENT
 REFERENCES

키워드

저자

• Sangkwon Jeong [ Cryogenic Engineering Laboratory, Department of Mechanical Engineering, KAIST, Daejeon, Republic of Korea ] Corresponding author
• Changgi Park [ Cryogenic Engineering Laboratory, Department of Mechanical Engineering, KAIST, Daejeon, Republic of Korea ]

참고문헌

발행기관

간행물

표지보기 관심저널 등록

• 간행물명

  한국초전도·저온논문지 (구 한국초전도저온공학회논문지) [Progress in Superconductivity and Cryogenics]

• 간기

  계간

• pISSN

  1229-3008

• eISSN

  2287-6251

• 수록기간

  1999~2026

• 등재여부

  KCI 등재,SCOPUS

• 십진분류

  KDC 427 DDC 537