Earticle

초록

영어

In this paper, reduces the absolute temperature of the LED module, results of the experiments have been derived a method to improve the suitability heat dissipation structure and properties are as follows. First, FR-4 PCB size in consideration of the PCB LED module air-hole 3mm radius of the LED module area 10%, 20%, 30% ratio after a process of simulation to generate the air-hole on the PCB and the surrounding, 30%, 50×30mm intervals, when generating a fifty-two, applying the air-hole 3mm 10% of the radius of the area LED module obtained the results of temperature reduction than max. about 3.5℃ and min. about 3.1℃. Second, LED array interval and to be suitable experimental structure through the PCB air-hole generation plate type heat-sink for LED module to support the air-hole radius 40mm size to create a two and six and four, as a result of the simulation in progress, when air-hole number pairs of the increase, max. and min. temperature was reduced to obtain a formal conclusion by about 1~1.5℃. the air-hole 3mm 10% of the radius of the area applied LED module than max. about 4.5℃, min. about 4.2℃ results was confirmed reduction. As a result, to the suitable of the heat dissipation even if the LED module PCB material no matter how good, if the heat sink is not well designed structural cannot obtain a large effect.

목차

Abstract
 1. Introduction
 2. Theory
  2.1 Thermal Design Process
  2.2 PCB Air-Hole Apply Comparative Experiments
  2.3 Heat-Sink Air-Hole Apply Comparison Test
  2.4 Thermal Design Experimental Analysis
 3. Conclusion
 Acknowledgements
 References

키워드

저자

• Keum-yeon Choi [ Honam University, Gwang-Ju City, Korea ]
• Ik-soo Eo [ Honam University, Gwang-Ju City, Korea ]

참고문헌

발행기관

간행물

표지보기 관심저널 등록

• 간행물명

  International Journal of Multimedia and Ubiquitous Engineering

• 간기

  월간

• pISSN

  1975-0080

• 수록기간

  2008~2016

• 등재여부

  SCOPUS

• 십진분류

  KDC 505 DDC 605