As an emerging technology for on-chip interconnect scaling in vertical direction in semiconductor industry, through-silicon-via (TSV) demonstrates its advantages and has been adopted for 3D SoC implementation. Optimal test architecture and test scheduling are significant for stacked 3D SoC design. However existing design methods cannot achieve both optimal test time and individual rationality. In this paper, game theory based 3D SoC test architecture optimization and test scheduling method is proposed under constraints of the available number of TSVs for test time minimization and rational test band width allocation. VCG algorithm is brought to 3D SoC design. Three kinds of stacked SoCs are built using ITC’02 SoC test benchmarks, and experimental results on them show the advantages of the proposed method over prior work.
목차
Abstract 1. Introduction 2. Related Works 3. Problem Definition 3.1. Test Architecture for Stacked SoC 3.2. Test Architecture Optimization for 3D SoC 4. 3D SoC Test Optimization Model 4.1. Problem Formulation 4.2. 3D SoC Test Architecture Optimization 4.3. Algorithm for 3D SoC Test Optimization Based on Game Theory 4.4. Nash Equilibrium 5. Experimental Results 6. Conclusion Acknowledgements References
Jingbo Shao [ Postdoctoral Research Station of Information and Communication Engineering, Harbin Engineering University, Harbin 150001, China, College of Computer Science and Information Engineering, Harbin Normal University, Harbin 150025, China ]
Yongqing Fu [ Postdoctoral Research Station of Information and Communication Engineering, Harbin Engineering University, Harbin 150001, China ]
Xiaoxiao Liu [ College of Information, Beijing City University, Beijing 100083, China ]
Guohui Zhou [ College of Computer Science and Information Engineering, Harbin Normal University, Harbin 150025, China ]
보안공학연구지원센터(IJMUE) [Science & Engineering Research Support Center, Republic of Korea(IJMUE)]
설립연도
2006
분야
공학>컴퓨터학
소개
1. 보안공학에 대한 각종 조사 및 연구
2. 보안공학에 대한 응용기술 연구 및 발표
3. 보안공학에 관한 각종 학술 발표회 및 전시회 개최
4. 보안공학 기술의 상호 협조 및 정보교환
5. 보안공학에 관한 표준화 사업 및 규격의 제정
6. 보안공학에 관한 산학연 협동의 증진
7. 국제적 학술 교류 및 기술 협력
8. 보안공학에 관한 논문지 발간
9. 기타 본 회 목적 달성에 필요한 사업
간행물
간행물명
International Journal of Multimedia and Ubiquitous Engineering
간기
월간
pISSN
1975-0080
수록기간
2008~2016
등재여부
SCOPUS
십진분류
KDC 505DDC 605
이 권호 내 다른 논문 / International Journal of Multimedia and Ubiquitous Engineering Vol.10 No.2