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Research on Preparation of Ni/SiO2 Optical Attenuation Slice by Magnetron Sputtering

첫 페이지 보기
  • 발행기관
    보안공학연구지원센터(IJCA) 바로가기
  • 간행물
    International Journal of Control and Automation SCOPUS 바로가기
  • 통권
    Vol.7 No.12 (2014.12)바로가기
  • 페이지
    pp.375-382
  • 저자
    Lei Li, Hui Tang, Shanshan Hao, Wenxue Wang
  • 언어
    영어(ENG)
  • URL
    https://www.earticle.net/Article/A239184

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원문정보

초록

영어
In order to find new methods for preparing and improving the performance of optical attenuation slice. Vacuum magnetron sputtering method was used to prepare Ni/SiO2 composite film optical attenuation slices, with vacuum magnetron sputtering apparatus, at 5,10,15,20,25min sputtering time, 0.2,0.4,0.6,0.8,1.0Pa sputtering pressure and sputtering power 300~1200W. The XRD, SEM, EDS, AFM and 722 spectrophotometer also were used to study the effects of different sputtering time, sputtering pressure and sputtering power on the film structure, surface morphology, composition, three-dimensional structure, surface roughness and light attenuation rate of optical attenuation slice samples. The results indicated that: Ni/SiO2 composite films were formed, instead of simple physical adsorption between Ni film and SiO2 substrates with magnetron sputtering by XRD analysis and calculation, with uniform grain size of 25.96, 32.38, 32.29,26.95, 25.92nm, respectively. The main component element was Ni, but there were few impurities deposited on the substrates. Impurities were reduced gradually with the increase of sputtering time, mainly resulted from two sputtering of Ni atoms by EDS; The film surface was smooth and dense, flatness and organizational structure of Ni film were better, surface roughness was 1.267nm at 25min sputtering time, 0.4Pa pressure and 400W power with SEM and AFM. Light attenuation rate of optical attenuation slices was different in different process parameters, and the maximum reached 0.52, film flatness, impurities and defects were the main reason by the light attenuation performance analysis.

목차

Abstract
 1. Introduction
 2. Experimental
 3. Results and Discussion
  3.1 Effect of Sputtering Pressure on the Film Structure
  3.2 Effect of Sputtering Time on the Film Surface Morphology
  3.3 Effect of Sputtering Power on Micro Structure and Flatness
  3.4 Effect of Sputtering Power on Transmittance
 4. Conclusion
 Acknowledgements
 References

키워드

optical attenuation slice magnetron sputtering attenuation ratio

저자

  • Lei Li [ School of Materials Science and Engineering Harbin University of Science and Technology CHINA 150040 ]
  • Hui Tang [ School of Materials Science and Engineering Harbin University of Science and Technology CHINA 150040 ]
  • Shanshan Hao [ School of Materials Science and Engineering Harbin University of Science and Technology CHINA 150040 ]
  • Wenxue Wang [ School of Materials Science and Engineering Harbin University of Science and Technology CHINA 150040 ]

참고문헌

자료제공 : 네이버학술정보

간행물 정보

발행기관

  • 발행기관명
    보안공학연구지원센터(IJCA) [Science & Engineering Research Support Center, Republic of Korea(IJCA)]
  • 설립연도
    2006
  • 분야
    공학>컴퓨터학
  • 소개
    1. 보안공학에 대한 각종 조사 및 연구 2. 보안공학에 대한 응용기술 연구 및 발표 3. 보안공학에 관한 각종 학술 발표회 및 전시회 개최 4. 보안공학 기술의 상호 협조 및 정보교환 5. 보안공학에 관한 표준화 사업 및 규격의 제정 6. 보안공학에 관한 산학연 협동의 증진 7. 국제적 학술 교류 및 기술 협력 8. 보안공학에 관한 논문지 발간 9. 기타 본 회 목적 달성에 필요한 사업

간행물

  • 간행물명
    International Journal of Control and Automation
  • 간기
    월간
  • pISSN
    2005-4297
  • 수록기간
    2008~2016
  • 십진분류
    KDC 505 DDC 605

이 권호 내 다른 논문 / International Journal of Control and Automation Vol.7 No.12

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