Earticle

초록

영어

The mechanical, electrical and thermal characteristics of insulating materials may significantly affect the performance and reliability of electrical devices using superconductors. General method to provide insulating layer between coated conductors is wrapping coated conductor with Kapton tape. But uniform and compact wrapping without failure or delamination in whole coverage for long length conductor is not a simple task and need careful control. Coating of insulating layer directly on coated conductor is desirable for providing compact insulating layer rather than wrapping insulating layers around conductor. Ceramic added polymer has been widely used as an insulating material for electric machine because of its good electrical insulating properties as well as excellent heat resistance and fairy good mechanical properties. The insulating layer of coated conductor should have high breakdown voltage and possesses suitable mechanical strength and maintain adhesiveness at the cryogenic temperature where it is used and withstand stress from thermal cycling. The insulating and mechanical properties of polymer can be improved by adding functional filler. In this study, insulating layer has been made by adding ceramic particles such as SiO2 to a polymer resin. The size, amount and morphology of added ceramic powder was controlled and their effect on dielectric property of the final composite was measured and discussed for optimum composite fabrication.

목차

Abstract
 1. INTRODUCTION
 2. EXPERIMENTS
 3. RESULTS & DISCUSSION
  3.1. 절연 코팅층의 표면 미세조직
  3.2. 절연측의 접착성
  3.3. 절연파괴강도
 4. CONCLUSION
 ACKNOWLEDGMENT
 EXAMPLE REFERENCES

키워드

저자

• S. Y. Kim [ Korea Polytechnic University, Gyeonggi-do, Korea ]
• J. B. Lee [ Green Resource Co., Ltd. ]
• B. G. Kwon [ Korea Polytechnic University, Gyeonggi-do, Korea ]
• G. W. Hong [ Korea Polytechnic University, Gyeonggi-do, Korea ] Corresponding author

참고문헌

발행기관

간행물

표지보기 관심저널 등록

• 간행물명

  한국초전도·저온논문지 (구 한국초전도저온공학회논문지) [Progress in Superconductivity and Cryogenics]

• 간기

  계간

• pISSN

  1229-3008

• eISSN

  2287-6251

• 수록기간

  1999~2026

• 등재여부

  KCI 등재,SCOPUS

• 십진분류

  KDC 427 DDC 537