During the grinding, the principal axis drives the grinding wheel to rotate at a high speed, which generates disturbance to the air flows around the grinding wheel. Therefore, a layer of air boundary can be formed on the surface of the working grinding wheel, which is the airflow field. Airflow field not only affects the machining accuracy of the workpiece and the enhanced abrasion of grinding wheel, but also prevents the efficient injection of the grinding fluid into the grinding zone. These processing conditions and lead to the increasing grinding force and rising grinding temperature, deteriorating the processing quality and surface integrity of the workpiece. With higher rotation speed of grinding wheel, the “airbond” of the air flow will be greater. And the grinding fluid will be harder to break through the “airbond” and be supplied to the grinding zone. In this study, on the basis of theoretical analysis on the airflow field of grinding wheel, a mathematical model was established, including the internal and external pressure differences of the airflow field, the airbond thickness δ, fluid density ρ, radius R and radius ω. In addition, the changing rules of airflow field along the grinding wheel were studied based on simulation tests. Results demonstrate that the tested airflow field presented the same pressure in concentric circles of the grinding wheel. Along the surface outer normal direction, the pressure value gradually decreased from the outer to the inner space, presenting negative pressure gradient. The velocity of the airflow field around the grinding wheel reduced as the distance from the wheel increased. To a certain thickness, the velocity became zero, which verified the existence of the boundary layer.
목차
Abstract 1. Introduction 2. Surface Airbond Analysis 3. Theoretical Modeling of the Airflow Field of Grinding Wheel 4. Simulation of the Airflow Field of Grinding Wheel 5. Impact of the Rotating Velocity of Grinding Wheel on AirbondThickness 6.Conclusion Acknowledgements References
보안공학연구지원센터(IJCA) [Science & Engineering Research Support Center, Republic of Korea(IJCA)]
설립연도
2006
분야
공학>컴퓨터학
소개
1. 보안공학에 대한 각종 조사 및 연구
2. 보안공학에 대한 응용기술 연구 및 발표
3. 보안공학에 관한 각종 학술 발표회 및 전시회 개최
4. 보안공학 기술의 상호 협조 및 정보교환
5. 보안공학에 관한 표준화 사업 및 규격의 제정
6. 보안공학에 관한 산학연 협동의 증진
7. 국제적 학술 교류 및 기술 협력
8. 보안공학에 관한 논문지 발간
9. 기타 본 회 목적 달성에 필요한 사업
간행물
간행물명
International Journal of Control and Automation
간기
월간
pISSN
2005-4297
수록기간
2008~2016
십진분류
KDC 505DDC 605
이 권호 내 다른 논문 / International Journal of Control and Automation Vol.6 No.4