Li Zhe, Li Yongfu, Zhai Quanpeng, Zheng Minli, Li Long
언어
영어(ENG)
URL
https://www.earticle.net/Article/A204708
※ 원문제공기관과의 협약기간이 종료되어 열람이 제한될 수 있습니다.
원문정보
초록
영어
In this paper, as workpiece lCrl8Ni9Ti for researching foundation, under turning experiments, with the high speed camera, piezoelectric dynamometer and FEM thermal imager, get relevant data from the cutting process, analyze the effect law of geometry shape and chip type from the cutting force, cutting heat, tool wear and breakage as well, in the removal process. By analyzing and summarizing the tool wear position, study the formation, curl, liquidity of chip and their influencing factors. In short, research on the corresponding relationship between tool wear position and chip type in cutting process, which provides a theoretical basis for the breakage and adhesive prediction of tool in the cutting process.
목차
Abstract 1. Introduction 2. Cutting Experiment 2.1. Experiment Conditions 3. Cutting Experiment Result Analysis 3.1. Relationship between Tool Wear Position and Chip Type 3.2. Influence of the Cutting Edge Wear upon the Chip Type 3.3. Influence of the Groove Wear upon the Chip Type 3.4. Influence of the Border Wear of the Minor Cutting Edge upon Chip Type 4. Conclusions Acknowledgements References
키워드
turningtool wearchip type
저자
Li Zhe [ School of Mechanical and Power Engineering, Harbin University of Science and Technology, Harbin 150080, China ]
Li Yongfu [ School of Mechanical and Power Engineering, Harbin University of Science and Technology, Harbin 150080, China ]
Zhai Quanpeng [ School of Mechanical and Power Engineering, Harbin University of Science and Technology, Harbin 150080, China ]
Zheng Minli [ School of Mechanical and Power Engineering, Harbin University of Science and Technology, Harbin 150080, China ]
Li Long [ School of Mechanical and Power Engineering, Harbin University of Science and Technology, Harbin 150080, China ]
보안공학연구지원센터(IJSH) [Science & Engineering Research Support Center, Republic of Korea(IJSH)]
설립연도
2006
분야
공학>컴퓨터학
소개
1. 보안공학에 대한 각종 조사 및 연구
2. 보안공학에 대한 응용기술 연구 및 발표
3. 보안공학에 관한 각종 학술 발표회 및 전시회 개최
4. 보안공학 기술의 상호 협조 및 정보교환
5. 보안공학에 관한 표준화 사업 및 규격의 제정
6. 보안공학에 관한 산학연 협동의 증진
7. 국제적 학술 교류 및 기술 협력
8. 보안공학에 관한 논문지 발간
9. 기타 본 회 목적 달성에 필요한 사업
간행물
간행물명
International Journal of Smart Home
간기
격월간
pISSN
1975-4094
수록기간
2008~2016
십진분류
KDC 505DDC 605
이 권호 내 다른 논문 / International Journal of Smart Home Vol.7 No.5