Earticle

초록

영어

As information-oriented industry has been developed and electronic devices has come to be smaller, lighter, multifunctional, and high speed, the components used to the devices need to be much high density and should have find pattern due to high integration. Also, diverse reliability problems happen as user environment is getting harsher. For this reasons, establishing and securing products and components reliability comes to key factor in company’s competitiveness. It makes accelerated test important to check product reliability in fast way. Out of fine pattern failure modes, failure of Electrochemical Migration(ECM) is kind of degradation of insulation resistance by electro-chemical reaction, which it comes to be accelerated by biased voltage in high temperature and high humidity environment. In this thesis, the accelerated life test for failure caused by ECM on fine pattern substrate, 20/20㎛ pattern width/space applied by Semi Additive Process, was performed, and through this test, the investigation of failure mechanism and the life-time prediction evaluation under actual user environment was implemented. The result of accelerated test has been compared and estimated with life distribution and life stress relatively by using Minitab software and its acceleration rate was also tested. Through estimated weibull distribution, B10 life has been estimated under 95% confidence level of failure data happened in each test conditions. And the life in actual usage environment has been predicted by using generalized Eyring model considering temperature and humidity by developing Arrhenius reaction rate theory, and acceleration factors by test conditions have been calculated.

목차

Abstract
 1. 서론
 2. 이론적 배경
  2.1 Packaging Substrate PCB의 제조 동향과 신뢰성 문제
  2.2 Electrochemical Migration(ECM, 전기화학적 마이그레이션)
  2.3 가속수명 시험(Accelerated Life Testing:ALT)
 3. Packaging Substrate에 대한 가속 수명 실험
 4. 실험 결과 및 신뢰도 예측
  4.1 시험 결과
  4.2 고장 분석
  4.3 사용 수명 예측
 5. 결론
 6. 참고문헌

키워드

저자

• 강대중 [ Dae-Joong Kang | 인하대학교 공학대학원 산업경영정보공학과 ]
• 이화기 [ Hwa Ki Lee | 인하대학교 산업공학과 ] Corresponding Auther

참고문헌

발행기관

간행물

표지보기 관심저널 등록

• 간행물명

  대한안전경영과학회지 [Journal of Korea Safety Management & Science]

• 간기

  계간

• pISSN

  1229-6783

• eISSN

  2288-1484

• 수록기간

  1999~2025

• 십진분류

  KDC 530 DDC 620