Earticle

초록

영어

The measurement of the coefficient of thermal expansion (CTE) of polypropylene laminated paper (PPLP) as electric insulating material is important for its practical superconducting device application. The thermal strain induced to HTS tapes and its insulating material during cooling from room temperature might largely affect the critical current (Ic) of HTS tapes. In this study, the thermal contraction of PPLP material was measured during cooling from 300 K to 77 K using double extensometers. Initially, the CTE of a brass tape was measured and it was compared with a reference data. It was found that the measured thermal expansion data of the brass material approaches that of the reference one. Based on the results, it was then confirmed that the measurement technique could be applied to thin and flexible samples. Therefore, the same measurement procedure was applied to PPLP material using double extensometers. As a result, the linear CTE of the PPLP at 77 K has been measured to be ~ 15.3 x 10-6/K. Also, it was found that the thermal contraction characteristics of PPLP was dominated by polypropylene on the cross direction (higher thermal contraction) while it was dominated by Kraft paper on the machine direction (lower thermal contraction). Overall, this measurement procedure could be adopted for the determination of CTE of flexible materials such as PPLP.

목차

Abstract
 1. INTRODUCTION
 2. EXPERIMENTAL PROCEDURE
  2.1 Sample
  2.2 Setup for CTE measurement
  2.3 Formulation for the determination of thermal contraction and CTE at cryogenic temperature
 3. RESULTS AND DISCUSSION
  3.1 Validity check of measurement procedure adopted
  3.2 CTE measurement of PPLP
 4. CONCLUSION
 ACKNOWLEDGMENT
 REFERENCES

키워드

저자

• Marlon J. Dedicatoria [ Department of Mechanical Design Engineering, Andong National University ]
• John Ryan C. Dizon [ Department of Mechanical Design Engineering, Andong National University, Bataan Peninsula State University, Philippines ]
• Hyung-Seop Shin [ Department of Mechanical Design Engineering, Andong National University ] Corresponding author
• Ki-Duk Sim [ Korea Electrotechnology Research Institute ]

참고문헌

발행기관

간행물

표지보기 관심저널 등록

• 간행물명

  한국초전도·저온논문지 (구 한국초전도저온공학회논문지) [Progress in Superconductivity and Cryogenics]

• 간기

  계간

• pISSN

  1229-3008

• eISSN

  2287-6251

• 수록기간

  1999~2026

• 등재여부

  KCI 등재,SCOPUS

• 십진분류

  KDC 427 DDC 537