Jakirahemed. MD, M. J. Davidson, G. Venkateswarlu, L.Venugopal
언어
영어(ENG)
URL
https://www.earticle.net/Article/A166981
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원문정보
초록
영어
This paper deals with the effect of process parameters on the peak load and the energy absorption of the expansion of thin walled tubes using a die. The energy absorption and peak load during the expansion process were calculated for various punch angles (α) and with different expansion ratios (rp/ro) at different temperatures (T) by finite element analysis where rp is the punch outer radius and ro is the tube inner radius. The effect of these input parameters on the response parameters peak load, energy absorption and local buckling have been critically analyzed using Taguchi method. It is observed that the peak load and energy absorption of the expansion tube is influenced by expansion ratio (rp/ro), punch angle followed by tube temperature. The energy absorption of the expanded tube increases as the rp/ro ratio increases and also larger punch angle improves the energy absorption. Whereas the minimum expansion ratio (rp/ro) decreases the peak load at higher temperature and medium punch angle. The ANOVA performed on the experimental results revealed that the expansion ratio (rp/ro) is the most important process parameter that minimizes the peak load followed by punch angle and tube temperature. Also it is found that the expansion ratio improves the energy absorption.
목차
Abstract 1. Introduction 2. Methodology 3. Results and Discussions 3.1. Effect of the Process Parameter on Peak Load 3.2. Evaluation of Energy absorption 3.3. Analysis of Variance (ANOVA) 4. Conclusion References
보안공학연구지원센터(IJAST) [Science & Engineering Research Support Center, Republic of Korea(IJAST)]
설립연도
2006
분야
공학>컴퓨터학
소개
1. 보안공학에 대한 각종 조사 및 연구
2. 보안공학에 대한 응용기술 연구 및 발표
3. 보안공학에 관한 각종 학술 발표회 및 전시회 개최
4. 보안공학 기술의 상호 협조 및 정보교환
5. 보안공학에 관한 표준화 사업 및 규격의 제정
6. 보안공학에 관한 산학연 협동의 증진
7. 국제적 학술 교류 및 기술 협력
8. 보안공학에 관한 논문지 발간
9. 기타 본 회 목적 달성에 필요한 사업
간행물
간행물명
International Journal of Advanced Science and Technology
간기
월간
pISSN
2005-4238
수록기간
2008~2016
십진분류
KDC 505DDC 605
이 권호 내 다른 논문 / International Journal of Advanced Science and Technology Vol.36