Nam-Jin Lee, Sang-Soo Oh, Ho-Sup Kim, Dong-Woo Ha, Hong-Soo Ha, Rock-Kil Ko, Hyung-Seop Shin, Do-Jun Youm
언어
영어(ENG)
URL
https://www.earticle.net/Article/A124089
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※ 학술발표대회집, 워크숍 자료집 중 4페이지 이내 논문은 '요약'만 제공되는 경우가 있으니, 구매 전에 간행물명, 페이지 수 확인 부탁 드립니다.
4,000원
원문정보
초록
영어
A lamination system using reflow soldering was developed to enhance the mechanical properties of high temperature superconductor (HTS) tape. The laminated coated conductor tape was fabricated using the continuous lamination process. The mean, maximum, and minimum tensile loads in a T-peel test of the laminated coated conductor were 9.9 N, 12.5 N, and 7.6 N, respectively. The critical current (Ic) distributions of the non-laminated and laminated coated conductor were compared using a non-contact Hall probe method. The transport Ic nearly matched the non-contact Ic; however, some degraded Ic regions were found on the length of 800 cm of laminated coated conductor. We confirmed that the cause of the partially degraded Ic was due to an increase in line tension by (1) solidification induced by a change of composition that usually occurs in molten brass (Cu, Zn) in solder, or (2) non-homogeneity of the thickness of the coated conductor or metal tapes. We suggest that reflow soldering is a promising method for reinforced HTS tape if the controlling solder thickness and lamination guide are modified.